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DS1338Z-33+

Specifications

SKU: 11267627

BUY DS1338Z-33+ https://www.utsource.net/itm/p/11267627.html

Parameter Symbol Min Typical Max Unit Notes
Operating Voltage VCC 2.3 - 5.5 V
Supply Current (Active) ICC - 200 - nA
Supply Current (Shutdown) ICC(SD) - 1 - nA
Clock Output Frequency fOUT - 1.016 - MHz
Temperature Range Toper -40 - 85 °C
Package Type - SO-8 -
Size (L x W x H) - 5.0 x 4.4 x 1.6 - mm

Instructions for DS1338Z-33+

  1. Power Supply:

    • Ensure the operating voltage is within the range of 2.3V to 5.5V.
    • Connect VCC to the power supply and GND to ground.
  2. Clock Output:

    • The DS1338Z-33+ provides a 1.016 MHz clock output on the XOUT pin.
    • Use a 32.768 kHz crystal connected between the X1 and X2 pins for accurate timekeeping.
  3. Shutdown Mode:

    • To enter shutdown mode, set the SHDN pin high.
    • In shutdown mode, the supply current drops to approximately 1 nA.
  4. Data Communication:

    • The DS1338Z-33+ uses a two-wire serial interface (I2C).
    • Connect SDA (data) and SCL (clock) to the appropriate I2C lines.
    • Ensure pull-up resistors are used on the SDA and SCL lines.
  5. Register Access:

    • Use the I2C protocol to read from and write to the device registers.
    • The device address is 0x68 (1101000).
  6. Time Setting:

    • Set the time by writing to the appropriate registers (seconds, minutes, hours, day, date, month, year).
    • Time is stored in BCD (Binary-Coded Decimal) format.
  7. Reading Time:

    • Read the current time by reading the time registers.
    • Convert BCD values to binary if necessary.
  8. Alarm Function:

    • Set up alarms by configuring the alarm registers.
    • The INT/SQW pin can be configured to generate an interrupt or square wave output.
  9. Square Wave Output:

    • Configure the square wave frequency (1Hz, 4kHz, 8kHz, 32kHz) using the control register.
  10. Storage and Handling:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle with care to avoid static discharge, which can damage the component.
  11. Soldering:

    • Follow standard soldering practices for surface mount devices.
    • Preheat the board to reduce thermal shock during soldering.

For detailed specifications and additional information, refer to the DS1338Z-33+ datasheet provided by the manufacturer.

(For reference only)

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