Specifications
SKU: 11267627
Parameter | Symbol | Min | Typical | Max | Unit | Notes |
---|---|---|---|---|---|---|
Operating Voltage | VCC | 2.3 | - | 5.5 | V | |
Supply Current (Active) | ICC | - | 200 | - | nA | |
Supply Current (Shutdown) | ICC(SD) | - | 1 | - | nA | |
Clock Output Frequency | fOUT | - | 1.016 | - | MHz | |
Temperature Range | Toper | -40 | - | 85 | °C | |
Package Type | - | SO-8 | - | |||
Size (L x W x H) | - | 5.0 x 4.4 x 1.6 | - | mm |
Instructions for DS1338Z-33+
Power Supply:
- Ensure the operating voltage is within the range of 2.3V to 5.5V.
- Connect VCC to the power supply and GND to ground.
Clock Output:
- The DS1338Z-33+ provides a 1.016 MHz clock output on the XOUT pin.
- Use a 32.768 kHz crystal connected between the X1 and X2 pins for accurate timekeeping.
Shutdown Mode:
- To enter shutdown mode, set the SHDN pin high.
- In shutdown mode, the supply current drops to approximately 1 nA.
Data Communication:
- The DS1338Z-33+ uses a two-wire serial interface (I2C).
- Connect SDA (data) and SCL (clock) to the appropriate I2C lines.
- Ensure pull-up resistors are used on the SDA and SCL lines.
Register Access:
- Use the I2C protocol to read from and write to the device registers.
- The device address is 0x68 (1101000).
Time Setting:
- Set the time by writing to the appropriate registers (seconds, minutes, hours, day, date, month, year).
- Time is stored in BCD (Binary-Coded Decimal) format.
Reading Time:
- Read the current time by reading the time registers.
- Convert BCD values to binary if necessary.
Alarm Function:
- Set up alarms by configuring the alarm registers.
- The INT/SQW pin can be configured to generate an interrupt or square wave output.
Square Wave Output:
- Configure the square wave frequency (1Hz, 4kHz, 8kHz, 32kHz) using the control register.
Storage and Handling:
- Store the device in a dry environment to prevent moisture damage.
- Handle with care to avoid static discharge, which can damage the component.
Soldering:
- Follow standard soldering practices for surface mount devices.
- Preheat the board to reduce thermal shock during soldering.
For detailed specifications and additional information, refer to the DS1338Z-33+ datasheet provided by the manufacturer.
(For reference only)Inquiry - DS1338Z-33+