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MC68SEC000FU16

Specifications

SKU: 11269411

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IC MPU M680X0 16MHZ 64QFP
Parameter Description Value
Part Number Full Part Number MC68SEC000FU16
Package Type Package Style 16-Lead Plastic Quad Flat Pack (PQFP)
Operating Temperature Operating Temperature Range -40°C to +85°C
Supply Voltage (VCC) Supply Voltage Range 3.3V ± 0.3V
Clock Frequency (fCLK) Maximum Clock Frequency 25 MHz
Data Bus Width Data Bus Width 16-bit
Address Bus Width Address Bus Width 24-bit
Instruction Set Instruction Set Architecture Motorola 68000 Series
Power Consumption Typical Power Consumption at 25 MHz 400 mW
I/O Standards I/O Compatibility 3.3V TTL/CMOS
Pin Configuration Pin Count 16
Pin Pitch Pin Pitch (Lead Pitch) 0.8 mm
Package Body Size Package Body Size (L x W x H) 7.0 mm x 7.0 mm x 1.4 mm
Storage Temperature Storage Temperature Range -65°C to +150°C
ESD Protection Electrostatic Discharge (ESD) Protection HBM: 2000 V
RoHS Compliance RoHS Compliance Yes

Instructions for Use

  1. Power Supply Connections:

    • Connect VCC to the 3.3V power supply.
    • Connect GND to the ground.
  2. Clock Input:

    • Connect the clock signal to the CLK pin. Ensure the clock signal is stable and within the specified frequency range.
  3. Reset Input:

    • Connect the reset signal to the RST pin. A high level on this pin will reset the processor.
  4. Data and Address Buses:

    • Connect the data bus (D0-D15) to the appropriate external memory or peripheral devices.
    • Connect the address bus (A0-A23) to the corresponding address lines of the external memory or peripheral devices.
  5. Control Signals:

    • Connect control signals such as read/write (R/W), chip select (CS), and other necessary control lines to the appropriate pins.
  6. Decoupling Capacitors:

    • Place decoupling capacitors (e.g., 0.1 μF and 10 μF) close to the VCC and GND pins to reduce noise and ensure stable operation.
  7. Heat Dissipation:

    • Ensure adequate heat dissipation if operating at high frequencies or in high ambient temperatures.
  8. Storage and Handling:

    • Store the device in a dry, cool place and handle with care to avoid ESD damage. Use proper ESD protection measures when handling the device.
  9. Testing:

    • Before final assembly, test the device using a known good setup to ensure it meets the specified performance parameters.
  10. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific use cases.
(For reference only)

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