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SN74LVC1G126DBV

Specifications

SKU: 11286029

BUY SN74LVC1G126DBV https://www.utsource.net/itm/p/11286029.html
Logic circuit Buffer/Line Driver SN74LVC1G126DBV SOT-153/SOT23-5/SC-74A marking C26
Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage range 1.65 - 3.6 V
Input Low Voltage (VIL) Maximum input low voltage -0.5 - VCC - 0.8 V
Input High Voltage (VIH) Minimum input high voltage VCC + 0.8 - VCC + 0.5 V
Output Low Voltage (VOL) Maximum output low voltage at IOL = 4 mA -0.1 - 0.4 V
Output High Voltage (VOH) Minimum output high voltage at IOH = -4 mA VCC - 0.4 - VCC + 0.1 V
Propagation Delay Time (tpd) Propagation delay time from input to output - 4.5 - ns
Power Dissipation (Ptot) Total power dissipation - - 360 mW
Operating Temperature Range (TA) Ambient operating temperature range -40 - 85 °C
Storage Temperature Range (TSTG) Storage temperature range -65 - 150 °C

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the specified range of 1.65V to 3.6V.
    • Do not exceed the maximum supply voltage to avoid damaging the device.
  2. Input Voltage Levels:

    • The input low voltage (VIL) should be no higher than VCC - 0.8V.
    • The input high voltage (VIH) should be no lower than VCC + 0.8V.
  3. Output Voltage Levels:

    • The output low voltage (VOL) should be no higher than 0.4V when sourcing 4 mA.
    • The output high voltage (VOH) should be no lower than VCC - 0.4V when sinking -4 mA.
  4. Propagation Delay:

    • The propagation delay time (tpd) from input to output is typically 4.5 ns. This value can vary slightly based on operating conditions.
  5. Power Dissipation:

    • The total power dissipation (Ptot) should not exceed 360 mW to prevent overheating and potential damage to the device.
  6. Temperature Ranges:

    • The ambient operating temperature (TA) should be between -40°C and 85°C.
    • The storage temperature (TSTG) should be between -65°C and 150°C.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge and physical damage.
    • Store the device in a dry, cool environment within the specified storage temperature range.
  8. Soldering:

    • Use appropriate soldering techniques to avoid thermal shock and ensure reliable connections.
    • Follow the recommended soldering profile provided by the manufacturer.
(For reference only)

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