Specifications
SKU: 11286029
Logic circuit Buffer/Line Driver SN74LVC1G126DBV SOT-153/SOT23-5/SC-74A marking C26
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (VCC) | Operating supply voltage range | 1.65 | - | 3.6 | V |
Input Low Voltage (VIL) | Maximum input low voltage | -0.5 | - | VCC - 0.8 | V |
Input High Voltage (VIH) | Minimum input high voltage | VCC + 0.8 | - | VCC + 0.5 | V |
Output Low Voltage (VOL) | Maximum output low voltage at IOL = 4 mA | -0.1 | - | 0.4 | V |
Output High Voltage (VOH) | Minimum output high voltage at IOH = -4 mA | VCC - 0.4 | - | VCC + 0.1 | V |
Propagation Delay Time (tpd) | Propagation delay time from input to output | - | 4.5 | - | ns |
Power Dissipation (Ptot) | Total power dissipation | - | - | 360 | mW |
Operating Temperature Range (TA) | Ambient operating temperature range | -40 | - | 85 | °C |
Storage Temperature Range (TSTG) | Storage temperature range | -65 | - | 150 | °C |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (VCC) is within the specified range of 1.65V to 3.6V.
- Do not exceed the maximum supply voltage to avoid damaging the device.
Input Voltage Levels:
- The input low voltage (VIL) should be no higher than VCC - 0.8V.
- The input high voltage (VIH) should be no lower than VCC + 0.8V.
Output Voltage Levels:
- The output low voltage (VOL) should be no higher than 0.4V when sourcing 4 mA.
- The output high voltage (VOH) should be no lower than VCC - 0.4V when sinking -4 mA.
Propagation Delay:
- The propagation delay time (tpd) from input to output is typically 4.5 ns. This value can vary slightly based on operating conditions.
Power Dissipation:
- The total power dissipation (Ptot) should not exceed 360 mW to prevent overheating and potential damage to the device.
Temperature Ranges:
- The ambient operating temperature (TA) should be between -40°C and 85°C.
- The storage temperature (TSTG) should be between -65°C and 150°C.
Handling and Storage:
- Handle the device with care to avoid static discharge and physical damage.
- Store the device in a dry, cool environment within the specified storage temperature range.
Soldering:
- Use appropriate soldering techniques to avoid thermal shock and ensure reliable connections.
- Follow the recommended soldering profile provided by the manufacturer.
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