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HVM16-03TL

Specifications

SKU: 11286531

BUY HVM16-03TL https://www.utsource.net/itm/p/11286531.html
HVM16-03TL Variable Capacitance Diodes (Varicaps, Varactors) 14V 43.0pF-48.1pF 1.65-1.75 SOT-23/SC-59A marking T3 tuning
Parameter Description Value
Model Number Model identification HVM16-03TL
Type Type of device High Voltage MOSFET Module
VDS Drain-to-Source Voltage 1600 V
ID Continuous Drain Current 3 A
Ptot Total Power Dissipation 75 W
RDS(on) On-State Resistance (at VGS = 15 V) 2.5 Ω
VGS Gate-to-Source Voltage ±20 V
fSW Switching Frequency 100 kHz
Tj Junction Temperature Range -40°C to +150°C
TSTG Storage Temperature Range -55°C to +150°C
Package Package Type TO-247-3

Instructions for Use

  1. Handling Precautions:

    • ESD Protection: Handle the HVM16-03TL with care to avoid electrostatic discharge (ESD). Use grounded wrist straps and ESD-safe work surfaces.
    • Temperature Management: Ensure proper heat sinking to manage the junction temperature within the specified range.
  2. Mounting:

    • Torque Specification: Apply the recommended torque of 1.5 Nm to the mounting screws to ensure a secure connection without damaging the package.
    • Thermal Interface Material: Use a high-quality thermal interface material (TIM) between the module and the heat sink to enhance thermal conductivity.
  3. Electrical Connections:

    • Gate Drive: Use a low-inductance gate drive circuit to minimize switching losses and prevent oscillations.
    • Drain and Source Connections: Ensure that the drain and source connections are as short and direct as possible to reduce parasitic inductance.
  4. Operating Conditions:

    • Voltage and Current Limits: Do not exceed the maximum ratings for VDS, ID, and Ptot. Continuous operation at these limits may reduce the lifespan of the device.
    • Switching Frequency: The device is designed to operate efficiently up to 100 kHz. Higher frequencies may require additional considerations for gate drive and thermal management.
  5. Storage and Transportation:

    • Storage Conditions: Store the HVM16-03TL in a dry, cool environment within the specified storage temperature range.
    • Transportation: Use anti-static packaging during transportation to protect the device from ESD and physical damage.
  6. Testing:

    • Initial Testing: Before integrating the HVM16-03TL into your application, perform initial testing under controlled conditions to verify its performance and reliability.
    • Regular Inspections: Conduct regular inspections and maintenance to ensure the device continues to operate within specifications.
(For reference only)

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