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Specifications
SKU: 11287142
SI2301BDS MOSFET P-Channel -20V -2.4A 0.080ohm SOT-23 marking L1
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -55 | 55 | V | Maximum voltage between drain and source | |
| Gate-Source Voltage | VGS | -8 | 8 | V | Maximum voltage between gate and source | |
| Continuous Drain Current | ID | 4.2 | A | Continuous current through the drain | ||
| Pulse Drain Current | ID(pulse) | 10 | A | Peak pulse current through the drain (tp = 100 μs) | ||
| Power Dissipation | PD | 2.1 | W | Maximum power dissipation at TA = 25°C | ||
| Junction Temperature | TJ | -40 | 150 | °C | Operating junction temperature range | |
| Storage Temperature | TSTG | -65 | 150 | °C | Temperature range for storage | |
| Thermal Resistance | RθJC | 35 | °C/W | Junction-to-case thermal resistance | ||
| Gate Charge | QG | 9.5 | nC | Total gate charge | ||
| Input Capacitance | Ciss | 300 | pF | Input capacitance at VDS = 10V | ||
| Output Capacitance | Coss | 40 | pF | Output capacitance at VDS = 10V | ||
| Reverse Transfer Capacitance | Crss | 12 | pF | Reverse transfer capacitance at VDS = 10V |
Instructions for Use:
Handling and Storage:
- Store the device in a dry, cool place within the specified storage temperature range.
- Handle with care to avoid mechanical stress and static discharge.
Mounting:
- Ensure proper heat sinking if operating near maximum power dissipation.
- Use recommended PCB layout guidelines to minimize parasitic inductances and capacitances.
Biasing:
- Apply the gate-source voltage (VGS) carefully to avoid exceeding the maximum ratings.
- Ensure that the gate is properly biased to control the drain current (ID).
Operating Conditions:
- Monitor the junction temperature (TJ) to ensure it stays within the safe operating range.
- Do not exceed the continuous or pulse drain current ratings to prevent damage.
Testing:
- Use appropriate test equipment and methods to measure parameters such as gate charge and capacitances.
- Follow safety guidelines when testing high-voltage and high-current circuits.
Soldering:
- Use a soldering iron with a controlled temperature to avoid thermal shock.
- Follow the recommended soldering profile provided by the manufacturer.
Applications:
- Suitable for switching applications in power supplies, motor control, and other high-frequency circuits.
- Ensure the device is used within its specified electrical and thermal limits for reliable performance.
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