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BSP78

Specifications

SKU: 11294936

BUY BSP78 https://www.utsource.net/itm/p/11294936.html
BSP78 MOSFET N-Channel 42v 3A SOT-223/SC-73/TO261-4 marking BSP78 low on-resistance/Low Gate Threshold Voltage/high impedance
Parameter Symbol Min Typ Max Unit Description
Collector-Emitter Voltage VCE - - 600 V Maximum voltage between collector and emitter with base open
Emitter-Collector Voltage VEC - - 600 V Maximum voltage between emitter and collector with base open
Base-Emitter Voltage (Forward) VBE(on) 1.8 2.5 3.0 V Base-emitter voltage at specified collector current and temperature
Base-Emitter Voltage (Reverse) VBE(reverse) - - 5.0 V Maximum reverse base-emitter voltage
Collector Current (Continuous) IC - - 10 A Maximum continuous collector current
Collector Current (Pulse) IC(pulse) - - 50 A Maximum pulse collector current (tp ≤ 10 ms, duty cycle ≤ 1%)
Power Dissipation PTOT - - 150 W Maximum total power dissipation (TA = 25°C)
Junction Temperature TJ - - 175 °C Maximum junction temperature
Storage Temperature Range TSTG -40 - 150 °C Operating and storage temperature range

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to maintain junction temperature within specified limits.
    • Use recommended mounting torque for screws to avoid damage.
  2. Biasing:

    • Apply base current (IB) to ensure the transistor is fully saturated when in the on state.
    • Ensure VBE does not exceed the maximum forward or reverse voltage ratings.
  3. Current Handling:

    • Do not exceed the maximum continuous or pulse collector current ratings.
    • For pulse applications, ensure the pulse duration and duty cycle are within specified limits.
  4. Thermal Management:

    • Monitor the junction temperature to prevent overheating.
    • Use thermal paste or thermal interface materials to enhance heat transfer from the transistor to the heat sink.
  5. Storage:

    • Store in a dry environment within the specified temperature range to avoid damage.
    • Handle with care to prevent mechanical stress or damage to the leads.
  6. Electrostatic Discharge (ESD) Protection:

    • Use appropriate ESD protection measures during handling and assembly to prevent damage to the device.
  7. Testing:

    • Perform initial testing under controlled conditions to verify the device parameters and performance.
    • Regularly inspect and test the device to ensure continued reliability and performance.
(For reference only)

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