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ATF-34143

Specifications

SKU: 11298382

BUY ATF-34143 https://www.utsource.net/itm/p/11298382.html

Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 2.7 - 5.5 V
Quiescent Current Iq - 0.001 - A
Output Current (Sink) Isink 0.1 20 50 mA
Output Current (Source) Isource 0.1 20 50 mA
Input Capacitance Cin - 5 - pF
Output Capacitance Cout - 8 - pF
Propagation Delay Time tpd - 1.7 - ns
High-Level Output Voltage VOH 2.4 - Vcc V
Low-Level Output Voltage VOL 0 - 0.4 V
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 2.7V to 5.5V.
    • Avoid exceeding the maximum voltage to prevent damage to the device.
  2. Quiescent Current (Iq):

    • The quiescent current is typically 0.001A. This value helps in power consumption calculations.
  3. Output Current:

    • The device can sink or source up to 50mA, but typical applications should not exceed 20mA to ensure reliable operation.
    • Ensure the load connected to the output does not exceed these current limits.
  4. Input and Output Capacitance:

    • The input capacitance is 5pF and the output capacitance is 8pF. These values are important for PCB layout and signal integrity considerations.
  5. Propagation Delay Time (tpd):

    • The propagation delay time is typically 1.7ns. This is crucial for timing and synchronization in high-speed circuits.
  6. Output Voltage Levels:

    • The high-level output voltage (VOH) is at least 2.4V and can go up to the supply voltage (Vcc).
    • The low-level output voltage (VOL) is at most 0.4V when the output is low.
  7. Operating Temperature (Topr):

    • The device is designed to operate between -40°C and 85°C. Ensure the operating environment stays within this range to avoid performance degradation or failure.
  8. Storage Temperature (Tstg):

    • When storing the device, keep it between -65°C and 150°C to prevent damage.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
  10. Mounting:

    • Solder the device according to the recommended soldering profile to ensure good electrical and mechanical connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  11. Testing:

    • Before integrating the device into a circuit, test it using the specified parameters to ensure it meets the required specifications.
  12. Compliance:

    • Ensure that the device complies with all relevant standards and regulations for the intended application.
(For reference only)

 Inquiry - ATF-34143