Specifications
SKU: 11298382
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | Vcc | 2.7 | - | 5.5 | V |
Quiescent Current | Iq | - | 0.001 | - | A |
Output Current (Sink) | Isink | 0.1 | 20 | 50 | mA |
Output Current (Source) | Isource | 0.1 | 20 | 50 | mA |
Input Capacitance | Cin | - | 5 | - | pF |
Output Capacitance | Cout | - | 8 | - | pF |
Propagation Delay Time | tpd | - | 1.7 | - | ns |
High-Level Output Voltage | VOH | 2.4 | - | Vcc | V |
Low-Level Output Voltage | VOL | 0 | - | 0.4 | V |
Operating Temperature | Topr | -40 | - | 85 | °C |
Storage Temperature | Tstg | -65 | - | 150 | °C |
Instructions for Use:
Supply Voltage (Vcc):
- Ensure the supply voltage is within the range of 2.7V to 5.5V.
- Avoid exceeding the maximum voltage to prevent damage to the device.
Quiescent Current (Iq):
- The quiescent current is typically 0.001A. This value helps in power consumption calculations.
Output Current:
- The device can sink or source up to 50mA, but typical applications should not exceed 20mA to ensure reliable operation.
- Ensure the load connected to the output does not exceed these current limits.
Input and Output Capacitance:
- The input capacitance is 5pF and the output capacitance is 8pF. These values are important for PCB layout and signal integrity considerations.
Propagation Delay Time (tpd):
- The propagation delay time is typically 1.7ns. This is crucial for timing and synchronization in high-speed circuits.
Output Voltage Levels:
- The high-level output voltage (VOH) is at least 2.4V and can go up to the supply voltage (Vcc).
- The low-level output voltage (VOL) is at most 0.4V when the output is low.
Operating Temperature (Topr):
- The device is designed to operate between -40°C and 85°C. Ensure the operating environment stays within this range to avoid performance degradation or failure.
Storage Temperature (Tstg):
- When storing the device, keep it between -65°C and 150°C to prevent damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Solder the device according to the recommended soldering profile to ensure good electrical and mechanical connections.
- Avoid excessive heat during soldering to prevent damage to the device.
Testing:
- Before integrating the device into a circuit, test it using the specified parameters to ensure it meets the required specifications.
Compliance:
- Ensure that the device complies with all relevant standards and regulations for the intended application.
Inquiry - ATF-34143