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UPC844G2

Specifications

SKU: 11299729

BUY UPC844G2 https://www.utsource.net/itm/p/11299729.html
operational amplifier UPC844G2 14pin marking C844G
Parameter Description Min Typ Max Unit
Supply Voltage (Vcc) Operating voltage range 2.7 - 5.5 V
Output Current (Iout) Maximum output current per channel - 100 - mA
Input Voltage Range (Vin) Valid input voltage for logic levels 0 - Vcc V
Propagation Delay (tPD) Time delay from input to output change 5 - 10 ns
Quiescent Current (IQ) Current drawn by the device when all inputs are low 0.1 - 1 μA
Operating Temperature (Toper) Temperature range for normal operation -40 - 85 °C
Storage Temperature (Tstg) Temperature range for storage -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 5.5V.
    • Connect Vcc to the power supply and GND to ground.
  2. Input Signals:

    • Apply input signals within the valid input voltage range (0V to Vcc).
    • Ensure input signals are stable and noise-free to avoid incorrect switching.
  3. Output Load:

    • Do not exceed the maximum output current (100mA) per channel to prevent damage to the device.
    • Use appropriate external components (e.g., resistors, capacitors) to manage load requirements.
  4. Propagation Delay:

    • Account for the propagation delay (5ns to 10ns) when designing timing-sensitive circuits.
  5. Quiescent Current:

    • The device draws minimal quiescent current (0.1μA to 1μA), which is beneficial for low-power applications.
  6. Operating and Storage Temperature:

    • Operate the device within the temperature range of -40°C to 85°C for optimal performance.
    • Store the device in a temperature range of -65°C to 150°C to ensure long-term reliability.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) handling procedures.
  8. Mounting and Soldering:

    • Use recommended soldering profiles to avoid thermal stress on the device.
    • Ensure proper alignment and secure mounting to prevent mechanical stress.
  9. Testing:

    • Perform initial testing under controlled conditions to verify functionality.
    • Monitor performance parameters regularly to ensure continued reliable operation.
(For reference only)

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