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Specifications
SKU: 11301248
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 600 | V | Maximum voltage between drain and source with gate open |
| Gate-Source Voltage | VGS | -15 | - | 20 | V | Maximum voltage between gate and source |
| Continuous Drain Current | ID | - | 40 | - | A | Continuous current through the drain at TC = 25°C |
| Pulse Drain Current | IDM | - | 80 | - | A | Non-repetitive peak pulse current through the drain |
| Power Dissipation | PTOT | - | - | 300 | W | Total power dissipation at TC = 25°C |
| Junction Temperature | TJ | - | - | 175 | °C | Maximum junction temperature |
| Storage Temperature | TSTG | -55 | - | 150 | °C | Operating and storage temperature range |
| Thermal Resistance | RθJC | - | 0.8 | - | °C/W | Junction-to-case thermal resistance |
| Input Capacitance | Ciss | - | 1900 | - | pF | Input capacitance at VDS = 300V, VGS = 0V |
| Output Capacitance | Coss | - | 100 | - | pF | Output capacitance at VDS = 300V, VGS = 0V |
| Reverse Transfer Capacitance | Crss | - | 150 | - | pF | Reverse transfer capacitance at VDS = 300V, VGS = 0V |
| Turn-on Delay Time | td(on) | - | 45 | - | ns | Turn-on delay time at ID = 20A, VGS = 15V |
| Rise Time | tr | - | 55 | - | ns | Rise time at ID = 20A, VGS = 15V |
| Turn-off Delay Time | td(off) | - | 45 | - | ns | Turn-off delay time at ID = 20A, VGS = 0V |
| Fall Time | tf | - | 55 | - | ns | Fall time at ID = 20A, VGS = 0V |
Instructions for Use:
Handling Precautions:
- Handle the device with care to avoid damage to the pins.
- Use appropriate ESD (Electrostatic Discharge) protection when handling the device.
Mounting:
- Ensure proper heat sinking to manage the thermal resistance and keep the junction temperature within safe limits.
- Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure reliable operation.
Biasing:
- Apply the gate-source voltage (VGS) within the specified range to avoid damaging the gate oxide.
- Ensure that the gate drive circuitry is capable of providing the necessary current to charge and discharge the gate capacitance quickly.
Operation:
- Operate the device within the specified temperature and voltage ranges to ensure reliable performance.
- Monitor the power dissipation and ensure it does not exceed the maximum rating to prevent overheating.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Keep the device in its original packaging until ready for use to protect against static discharge.
Testing:
- Use appropriate test equipment and methods to verify the device parameters.
- Refer to the datasheet for specific test conditions and procedures.
Inquiry - TGAN40N60FD
