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MTM15N50

Specifications

SKU: 11301273

BUY MTM15N50 https://www.utsource.net/itm/p/11301273.html

Parameter Symbol Min Typ Max Unit Description
Collector-Emitter Voltage VCEO - - 500 V Maximum voltage between collector and emitter with the base open
Emitter-Collector Voltage VECC - - 500 V Maximum voltage between emitter and collector with the base open
Collector-Base Voltage VCBO - - 500 V Maximum voltage between collector and base with the emitter open
Base-Emitter Voltage VBE - - 5.0 V Maximum voltage between base and emitter
Continuous Collector Current IC - 15 - A Maximum continuous current through the collector
Continuous Emitter Current IE - 15 - A Maximum continuous current through the emitter
Power Dissipation PT - - 200 W Maximum power dissipation at TA = 25°C
Junction Temperature TJ - - 150 °C Maximum junction temperature
Storage Temperature TSTG -55 - 150 °C Operating temperature range for storage
Thermal Resistance, Junction to Case RθJC - 0.6 - °C/W Thermal resistance from the junction to the case
Transition Frequency fT - 3.0 - MHz Frequency at which the current gain drops to unity
Saturation Voltage VCE(sat) - 1.8 2.5 V Collector-emitter saturation voltage at IC = 15A, IB = 1.5A
Storage Time tstg - 200 - ns Time required for the transistor to turn off completely

Instructions for Use:

  1. Handling:

    • Handle the MTM15N50 with care to avoid mechanical damage.
    • Use proper ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
  2. Mounting:

    • Ensure good thermal contact between the transistor and the heat sink.
    • Use a suitable thermal compound to enhance heat transfer.
    • Torque the mounting screws to the recommended specifications to avoid over-tightening.
  3. Operating Conditions:

    • Do not exceed the maximum ratings listed in the table.
    • Ensure that the junction temperature does not exceed 150°C.
    • Operate within the specified storage temperature range to avoid damage.
  4. Circuit Design:

    • Use appropriate decoupling capacitors to stabilize the power supply.
    • Ensure adequate base drive to achieve the desired current gain and switching performance.
    • Consider the transition frequency when designing high-frequency circuits.
  5. Testing:

    • Test the device under controlled conditions to verify its performance.
    • Use a suitable test setup to measure parameters such as VCE(sat) and IC.
  6. Storage:

    • Store the device in a dry, cool place away from direct sunlight.
    • Follow the recommended storage temperature range to ensure long-term reliability.
(For reference only)

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