Specifications
SKU: 11301485
Parameter | Symbol | Value | Unit |
---|---|---|---|
Maximum Drain Voltage | VDSS | 500 | V |
Maximum Gate-Source Voltage | VGS | ±20 | V |
Continuous Drain Current | ID | 18 | A |
Pulse Drain Current | IDM | 36 | A |
Power Dissipation | PD | 140 | W |
Junction Temperature | Tj | -55 to +175 | °C |
Storage Temperature | Tstg | -65 to +150 | °C |
Total Gate Charge | Qg | 140 | nC |
Input Capacitance | Ciss | 4900 | pF |
Output Capacitance | Coss | 1200 | pF |
Reverse Transfer Capacitance | Crss | 1100 | pF |
RDS(on) at VGS = 10V | RDS(on) | 0.025 | Ω |
Threshold Voltage | Vth | 4.0 to 5.0 | V |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to manage the power dissipation.
- Use recommended mounting torque for the screws to avoid damage.
Electrical Connections:
- Connect the drain (D), source (S), and gate (G) terminals correctly.
- Ensure all connections are secure and free from short circuits.
Operating Conditions:
- Do not exceed the maximum ratings listed in the table.
- Keep the junction temperature within the specified range to prevent thermal runaway.
Gate Drive:
- Use a gate resistor to control the switching speed and reduce ringing.
- Ensure the gate voltage is within the specified range to avoid damage.
Storage:
- Store in a dry, cool place away from direct sunlight.
- Handle with care to avoid static discharge which can damage the component.
Testing:
- Use appropriate test equipment and follow safety guidelines.
- Test the device under controlled conditions to ensure it meets the required specifications.
Handling:
- Use ESD protection when handling the component to prevent damage from static electricity.
- Avoid touching the leads directly; use proper tools for handling and soldering.
Soldering:
- Preheat the PCB to reduce thermal shock.
- Use a temperature-controlled soldering iron and avoid excessive heat and time during soldering.
Inquiry - MDF18N50TH