Share:


MDF18N50TH

Specifications

SKU: 11301485

BUY MDF18N50TH https://www.utsource.net/itm/p/11301485.html

Parameter Symbol Value Unit
Maximum Drain Voltage VDSS 500 V
Maximum Gate-Source Voltage VGS ±20 V
Continuous Drain Current ID 18 A
Pulse Drain Current IDM 36 A
Power Dissipation PD 140 W
Junction Temperature Tj -55 to +175 °C
Storage Temperature Tstg -65 to +150 °C
Total Gate Charge Qg 140 nC
Input Capacitance Ciss 4900 pF
Output Capacitance Coss 1200 pF
Reverse Transfer Capacitance Crss 1100 pF
RDS(on) at VGS = 10V RDS(on) 0.025 Ω
Threshold Voltage Vth 4.0 to 5.0 V

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to manage the power dissipation.
    • Use recommended mounting torque for the screws to avoid damage.
  2. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly.
    • Ensure all connections are secure and free from short circuits.
  3. Operating Conditions:

    • Do not exceed the maximum ratings listed in the table.
    • Keep the junction temperature within the specified range to prevent thermal runaway.
  4. Gate Drive:

    • Use a gate resistor to control the switching speed and reduce ringing.
    • Ensure the gate voltage is within the specified range to avoid damage.
  5. Storage:

    • Store in a dry, cool place away from direct sunlight.
    • Handle with care to avoid static discharge which can damage the component.
  6. Testing:

    • Use appropriate test equipment and follow safety guidelines.
    • Test the device under controlled conditions to ensure it meets the required specifications.
  7. Handling:

    • Use ESD protection when handling the component to prevent damage from static electricity.
    • Avoid touching the leads directly; use proper tools for handling and soldering.
  8. Soldering:

    • Preheat the PCB to reduce thermal shock.
    • Use a temperature-controlled soldering iron and avoid excessive heat and time during soldering.
(For reference only)

 Inquiry - MDF18N50TH