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30TPS12PBF

Specifications

SKU: 11301487

BUY 30TPS12PBF https://www.utsource.net/itm/p/11301487.html

Parameter Symbol Min Typ Max Unit Conditions
Input Voltage VIN 4.5 - 40 V
Output Voltage VOUT 1.0 - 18 V Adjustable, Set by External Resistors
Output Current IOUT - - 3.0 A Continuous
Quiescent Current IQ - 25 - μA No Load
Dropout Voltage VDROPOUT - 1.2 - V At Maximum Output Current
Shutdown Current ISD - 1 - μA SHDN = 0V
Operating Temperature TOPR -40 - 125 °C Junction Temperature
Storage Temperature TSTG -65 - 150 °C

Instructions for Use:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 40V.
    • Do not exceed the maximum input voltage to avoid damaging the device.
  2. Output Voltage (VOUT):

    • The output voltage can be adjusted between 1.0V and 18V using external resistors.
    • Use the formula: ( V_ = 1.23 left(1 + fracright) ) to set the desired output voltage, where ( R_1 ) and ( R_2 ) are the values of the external resistors.
  3. Output Current (IOUT):

    • The maximum continuous output current is 3.0A.
    • Ensure that the load does not draw more than this current to prevent overheating or damage.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 25μA when there is no load.
    • This low quiescent current helps in minimizing power consumption in low-load conditions.
  5. Dropout Voltage (VDROPOUT):

    • The dropout voltage is typically 1.2V at maximum output current.
    • Ensure that the input voltage is at least 1.2V higher than the output voltage to maintain regulation.
  6. Shutdown Current (ISD):

    • When the shutdown pin (SHDN) is pulled to 0V, the device enters a low-power shutdown mode with a typical current draw of 1μA.
    • Use this feature to conserve power when the device is not in use.
  7. Operating Temperature (TOPR):

    • The device can operate over a junction temperature range of -40°C to 125°C.
    • Ensure adequate heat dissipation to keep the junction temperature within this range, especially under high load conditions.
  8. Storage Temperature (TSTG):

    • Store the device in an environment with temperatures ranging from -65°C to 150°C to ensure long-term reliability.

Additional Notes:

  • Always refer to the datasheet for detailed information and specific application notes.
  • Proper PCB layout and component selection are crucial for optimal performance and reliability.
(For reference only)

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