Instructions for Use:

1. Mounting:

   • Ensure that the diode is mounted on a suitable PCB with proper spacing to allow for heat dissipation.
   • Avoid mechanical stress on the leads during soldering and handling.

2. Soldering:

   • Use a temperature-controlled soldering iron and do not exceed 300°C for more than 10 seconds.
   • Allow the diode to cool naturally after soldering.

3. Electrical Connections:

   • Connect the anode (A) to the positive side of the circuit and the cathode (K) to the negative side.
   • Ensure that the reverse voltage applied does not exceed the maximum repetitive peak reverse voltage (V_RRM).

4. Thermal Management:

   • If the diode will be operating near its maximum power dissipation, consider using a heatsink or ensuring adequate airflow around the component.
   • Monitor the junction temperature (T_J) to ensure it stays within the specified range.

5. Storage:

   • Store the diode in a dry, cool place away from direct sunlight and sources of heat.
   • Keep the diode in its original packaging until ready for use to prevent damage.

6. Handling:

   • Handle the diode with care to avoid damaging the leads or the body.
   • Use appropriate ESD protection when handling to prevent electrostatic discharge damage.

7. Testing:

   • When testing the diode, ensure that the test current (I_ZT) is within the specified range to avoid damaging the diode.
   • Measure the zener voltage (V_Z) under the specified test conditions to verify proper operation.