Share:
Specifications
SKU: 11526111
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Input Voltage (VIN) | Operating input voltage range | 2.7 | - | 5.5 | V |
| Output Voltage (VOUT) | Fixed output voltage | - | 3.3 | - | V |
| Output Current (IOUT) | Continuous output current | - | 2.0 | - | A |
| Quiescent Current (IQ) | Quiescent current | - | 1.0 | - | mA |
| Dropout Voltage (VDO) | Dropout voltage at IOUT = 2.0A | - | 0.4 | - | V |
| Load Regulation | Change in VOUT due to load changes | - | 0.5 | - | % |
| Line Regulation | Change in VOUT due to input voltage changes | - | 0.1 | - | % |
| Ripple Rejection | Attenuation of input ripple at 1kHz | - | 60 | - | dB |
| Thermal Shutdown Temperature (TSD) | Temperature at which thermal shutdown occurs | - | 160 | - | °C |
| Operating Temperature Range (TA) | Ambient operating temperature range | -40 | - | 85 | °C |
| Storage Temperature Range (TSTG) | Storage temperature range | -65 | - | 150 | °C |
| Package | Package type | - | SOT-23-5 | - | - |
Instructions for Use:
Input Connection:
- Connect the input voltage (VIN) to the VIN pin.
- Ensure the input voltage is within the specified range (2.7V to 5.5V).
Output Connection:
- Connect the output voltage (VOUT) to the VOUT pin.
- The output voltage is fixed at 3.3V.
Ground Connection:
- Connect the ground (GND) pin to the system ground.
Capacitors:
- Place a 1μF ceramic capacitor between VIN and GND as close to the device as possible.
- Place a 1μF ceramic capacitor between VOUT and GND as close to the device as possible.
Thermal Management:
- Ensure adequate heat dissipation if the device is operated at high output currents.
- The device will automatically shut down if the junction temperature exceeds 160°C.
Stability:
- The device is stable with ceramic capacitors. No additional external components are required for stability.
Storage and Handling:
- Store the device in a dry environment within the temperature range of -65°C to 150°C.
- Handle the device with care to avoid damage to the pins and package.
Testing:
- Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.
Inquiry - SY6288C20AAC
