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ADP1712AUJZ-3.3-R7

Specifications

SKU: 11527549

BUY ADP1712AUJZ-3.3-R7 https://www.utsource.net/itm/p/11527549.html

Parameter Description Min Typ Max Unit
Input Voltage (VIN) Operating input voltage range 2.3 - 5.5 V
Output Voltage (VOUT) Fixed output voltage - 3.3 - V
Output Current (IOUT) Continuous output current - 300 - mA
Dropout Voltage (VDROP) Typical dropout voltage at IOUT = 300mA - 220 - mV
Quiescent Current (IQ) Supply current with no load - 35 - μA
Shutdown Current (ISD) Supply current in shutdown mode - 0.1 - μA
PSRR (Power Supply Rejection Ratio) At 1kHz, VIN = 5V, IOUT = 10mA - 68 - dB
Thermal Shutdown Temperature Thermal shutdown threshold - 160 - °C
Operating Junction Temperature (TJ) Operating junction temperature range -40 - 125 °C
Storage Temperature (TS) Storage temperature range -65 - 150 °C

Instructions for Use:

  1. Input Capacitor (CIN):

    • A 1μF ceramic capacitor is recommended to stabilize the input.
    • Place the capacitor as close as possible to the input pin.
  2. Output Capacitor (COUT):

    • A 1μF ceramic capacitor is recommended to stabilize the output.
    • Place the capacitor as close as possible to the output pin.
  3. Thermal Considerations:

    • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
    • Use a heatsink or thermal pad if necessary to maintain the junction temperature within the specified range.
  4. Shutdown Pin (SHDN):

    • The shutdown pin can be used to place the device in a low-power state.
    • Apply a logic high (≥1.2V) to enable the regulator.
    • Apply a logic low (≤0.4V) to disable the regulator.
  5. Layout Guidelines:

    • Keep the PCB layout compact and minimize trace lengths to reduce parasitic inductance and improve stability.
    • Use wide traces for power paths to reduce resistance and heat generation.
  6. Handling Precautions:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Follow proper soldering techniques to ensure reliable connections and prevent thermal damage.
(For reference only)

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