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SN7534051N

Specifications

SKU: 11529330

BUY SN7534051N https://www.utsource.net/itm/p/11529330.html

Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage VCC 2.25 - 5.5 V -
Output Current (Source) IOH - 16 20 mA VOH = VCC - 0.4V, TA = 25°C
Output Current (Sink) IOL - 24 32 mA VOL = 0.4V, TA = 25°C
Input Voltage (High) VIH 2.0 - 5.5 V -
Input Voltage (Low) VIL 0.8 - 2.0 V -
Output Voltage (High) VOH 2.4 - VCC - 0.4 V IOH = 4mA, TA = 25°C
Output Voltage (Low) VOL 0 - 0.4 V IOL = 8mA, TA = 25°C
Propagation Delay Time (Input to Output) tpd - 20 45 ns VCC = 5V, TA = 25°C
Power Dissipation PD - - 625 mW TA = 25°C, derate 11mW/°C above 25°C
Operating Temperature Range TOP -40 - 125 °C -
Storage Temperature Range TSTG -65 - 150 °C -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.25V to 5.5V.
    • Connect the ground (GND) pin to the common ground of your system.
  2. Input Signals:

    • Apply input signals with voltages between 0.8V and 2.0V for a logic low (VIL).
    • Apply input signals with voltages between 2.0V and 5.5V for a logic high (VIH).
  3. Output Signals:

    • The output high voltage (VOH) will be at least 2.4V when sourcing up to 4mA.
    • The output low voltage (VOL) will be no more than 0.4V when sinking up to 8mA.
  4. Current Handling:

    • The device can source up to 20mA and sink up to 32mA per output.
    • Ensure that the total power dissipation does not exceed 625mW to avoid overheating.
  5. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 125°C.
    • Store the device within the temperature range of -65°C to 150°C.
  6. Propagation Delay:

    • The propagation delay time (tpd) from input to output is typically 20ns and can be up to 45ns at 5V supply voltage and 25°C ambient temperature.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge which can damage the internal components.
    • Follow proper soldering techniques to ensure reliable connections and avoid thermal stress on the device.
(For reference only)

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