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MBM29LV160BE-90PFTN

Specifications

SKU: 11529518

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Parameter Description Value Unit
Device Type Non-Volatile Memory 16 Mbit (2M x 8) Flash Memory -
Package Type Plastic Fine Pitch Ball Grid Array (PFBGA) 144-Ball -
Operating Voltage (Vcc) Supply Voltage Range 2.7 to 3.6 V
Standby Current (ISB) Standby Current at Vcc = 3.0V 5 μA
Active Current (IACT) Active Current at Vcc = 3.0V, fCLK = 50 MHz 20 mA
Programming Voltage (Vpp) Programming Voltage Not Required -
Programming Time Typical Programming Time per Byte 1.5 ms
Erase Time Typical Erase Time per Sector 1 s
Data Retention Data Retention Time 20 years
Temperature Range Industrial Temperature Range -40 to +85 °C
Write/Erase Cycles Endurance 100,000 cycles
Access Time (tACC) Access Time at Vcc = 3.0V, fCLK = 50 MHz 70 ns
Package Pin Pitch Ball Pitch 0.8 mm
Package Body Size Package Dimensions 20 x 20 x 1.2 mm

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 3.6V.
    • The device does not require a separate programming voltage (Vpp).
  2. Clock Frequency:

    • The device supports a clock frequency (fCLK) up to 50 MHz.
  3. Programming:

    • Use the standard command set for flash memory to program the device.
    • Typical programming time per byte is 1.5 milliseconds.
  4. Erase:

    • Erase operations can be performed on a sector-by-sector basis.
    • Typical erase time per sector is 1 second.
  5. Data Retention:

    • Data retention is guaranteed for up to 20 years under normal operating conditions.
  6. Temperature:

    • The device is rated for industrial temperature ranges from -40°C to +85°C.
  7. Endurance:

    • The device can withstand up to 100,000 write/erase cycles.
  8. Pin Configuration:

    • Refer to the datasheet for detailed pin configuration and ball assignments.
  9. Handling:

    • Handle the device with care to avoid static damage.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  10. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.

For more detailed information, refer to the full datasheet provided by the manufacturer.

(For reference only)

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