Specifications
SKU: 11530827
Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Input Voltage | VIN | - | 2.5 | - | 5.5 | V |
Output Voltage | VOUT | - | 0.8 | - | 5.0 | V |
Output Current | IOUT | - | - | 1.5 | 2.0 | A |
Switching Frequency | fSW | - | 1.0 | 1.2 | 1.5 | MHz |
Quiescent Current | IQ | VIN = 5V, VOUT = 3.3V | - | 30 | 60 | μA |
Shutdown Current | ISD | VIN = 5V, SHDN = 0V | - | 1 | 5 | μA |
Efficiency | η | VIN = 5V, VOUT = 3.3V | - | 92 | - | % |
Thermal Shutdown Temperature | TSD | - | - | 160 | - | °C |
Operating Junction Temperature | TJ | - | -40 | - | 125 | °C |
Instructions for MP1471AGJ-Z SOT23-6
Input Voltage (VIN):
- Ensure the input voltage is within the range of 2.5V to 5.5V to avoid damage to the device.
Output Voltage (VOUT):
- Set the output voltage using external resistors according to the formula provided in the datasheet. The output voltage can be adjusted from 0.8V to 5.0V.
Output Current (IOUT):
- The typical output current is 1.5A, with a maximum of 2.0A. Ensure the load does not exceed this limit to prevent overheating or damage.
Switching Frequency (fSW):
- The switching frequency is typically 1.2MHz, which helps in reducing the size of external components like inductors and capacitors.
Quiescent Current (IQ):
- The quiescent current is typically 30μA at 5V input and 3.3V output. This low quiescent current helps in improving efficiency.
Shutdown Current (ISD):
- When the shutdown pin (SHDN) is pulled low (0V), the shutdown current is typically 1μA, allowing the device to enter a low-power mode.
Efficiency (η):
- The efficiency is typically 92% at 5V input and 3.3V output. This high efficiency is crucial for power management applications.
Thermal Shutdown (TSD):
- The device will automatically shut down if the junction temperature exceeds 160°C to prevent thermal damage.
Operating Junction Temperature (TJ):
- The operating junction temperature range is from -40°C to 125°C. Ensure the device operates within this range to maintain reliability.
Layout Considerations:
- Use short and wide traces for power connections to minimize parasitic inductance and resistance.
- Place the input and output capacitors as close as possible to the IC to reduce noise and improve stability.
- Ensure proper grounding and decoupling to maintain stable operation and minimize electromagnetic interference (EMI).
Storage and Handling:
- Store the device in a dry environment to prevent moisture damage.
- Handle the device with care to avoid static discharge, which can damage the internal components.
Application Notes:
- Refer to the application notes provided in the datasheet for detailed information on designing circuits with the MP1471AGJ-Z, including component selection and layout guidelines.
Inquiry - MP1471AGJ-Z SOT23-6