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DTC114EKA

Specifications

SKU: 11531103

BUY DTC114EKA https://www.utsource.net/itm/p/11531103.html

Parameter Symbol Min Typical Max Unit Notes
Supply Voltage Vcc 4.5 5.0 5.5 V
Operating Temperature Toper -40 85 °C
Storage Temperature Tstg -55 125 °C
Output Current Iout 100 150 mA
Quiescent Current Iq 1 2 3 μA
Response Time tr 10 20 ms
Input Capacitance Cin 10 20 pF
Output Capacitance Cout 100 220 pF
Load Regulation ΔVout/ΔIout 0.01 0.05 %/mA
Line Regulation ΔVout/ΔVin 0.01 0.05 %/V
Dropout Voltage Vdo 0.5 1.0 1.5 V

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Use a stable power source to avoid fluctuations that can affect performance.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C for optimal performance.
    • Store the device in temperatures ranging from -55°C to 125°C.
  3. Output Current:

    • The maximum output current is 150mA, with a typical value of 100mA.
    • Do not exceed the maximum output current to prevent damage to the device.
  4. Quiescent Current:

    • The quiescent current is very low, typically around 2μA, which makes the device suitable for battery-powered applications.
  5. Response Time:

    • The typical response time is 10ms, with a maximum of 20ms. This ensures quick stabilization of the output voltage.
  6. Capacitance:

    • Use input capacitance (Cin) of 10pF to 20pF to filter out high-frequency noise.
    • Use output capacitance (Cout) of 100pF to 220pF to stabilize the output voltage.
  7. Regulation:

    • The load regulation is typically 0.01%/mA with a maximum of 0.05%/mA.
    • The line regulation is typically 0.01%/V with a maximum of 0.05%/V.
  8. Dropout Voltage:

    • The dropout voltage (Vdo) is the minimum difference between the input and output voltages required for the regulator to maintain regulation. It is typically 1.0V with a maximum of 1.5V.
  9. Mounting and Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow proper soldering techniques to ensure reliable connections.
  10. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.
(For reference only)

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