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IRFI3205PBF

Specifications

SKU: 11531348

BUY IRFI3205PBF https://www.utsource.net/itm/p/11531348.html

Parameter Symbol Min Typical Max Unit Conditions
Drain-Source Voltage VDS - - 55 V -
Gate-Source Voltage VGS -15 - 20 V -
Continuous Drain Current ID - 38 - A TC = 25°C
Continuous Drain Current ID - 29 - A TC = 100°C
Pulse Drain Current ID(pulse) - 114 - A tp = 10 μs, IG = 6 A, TC = 25°C
Power Dissipation Ptot - - 215 W TC = 25°C
Junction Temperature TJ - - 175 °C -
Storage Temperature TSTG -55 - 150 °C -
Thermal Resistance, Junction to Case RθJC - - 0.45 °C/W -
Input Capacitance Ciss - 1600 - pF VDS = 25 V, f = 1 MHz
Output Capacitance Coss - 125 - pF VDS = 25 V, f = 1 MHz
Reverse Transfer Capacitance Crss - 40 - pF VDS = 25 V, f = 1 MHz
Gate Charge QG - 105 - nC VGS = 10 V, ID = 29 A
Turn-On Delay Time td(on) - 42 - ns VGS = 10 V, ID = 29 A, RG = 2 Ω
Rise Time tr - 28 - ns VGS = 10 V, ID = 29 A, RG = 2 Ω
Turn-Off Delay Time td(off) - 24 - ns VGS = 10 V, ID = 29 A, RG = 2 Ω
Fall Time tf - 16 - ns VGS = 10 V, ID = 29 A, RG = 2 Ω

Instructions for Use:

  1. Mounting and Handling:

    • Ensure that the device is handled with care to avoid damage to the leads and the body.
    • Mount the device on a heatsink to manage thermal resistance and ensure proper heat dissipation.
  2. Biasing and Drive:

    • Apply the gate-source voltage (VGS) within the specified limits to avoid damaging the gate oxide.
    • Use appropriate gate drive circuits to ensure fast and reliable switching.
  3. Thermal Management:

    • Monitor the junction temperature (TJ) to prevent overheating.
    • Use thermal grease or thermal pads between the device and the heatsink to improve thermal conductivity.
  4. Electrical Stress:

    • Do not exceed the maximum drain-source voltage (VDS) or continuous drain current (ID).
    • Ensure that the power dissipation (Ptot) does not exceed the rated value.
  5. Storage and Operating Conditions:

    • Store the device in a dry, cool environment within the specified storage temperature range.
    • Operate the device within the specified operating temperature range to ensure reliability and longevity.
  6. Capacitance and Inductance:

    • Consider the input, output, and reverse transfer capacitances when designing the circuit to minimize parasitic effects.
    • Keep the gate drive loop inductance low to reduce ringing and overshoot during switching.
  7. Testing and Troubleshooting:

    • Test the device under controlled conditions to verify its performance.
    • Use oscilloscopes and other diagnostic tools to monitor waveforms and identify any issues.

By following these instructions, you can ensure optimal performance and reliability of the IRFI3205PBF MOSFET.

(For reference only)

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