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FB38N20D

Specifications

SKU: 11531358

BUY FB38N20D https://www.utsource.net/itm/p/11531358.html

Parameter Symbol Value Unit
Drain-Source Voltage VDS 200 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current ID 3.8 A
Pulse Drain Current (tp = 10 μs) ID(p) 14 A
Total Power Dissipation PTOT 60 W
Junction Temperature TJ -55 to +175 °C
Storage Temperature TSTG -55 to +150 °C
Thermal Resistance, Junction to Case RθJC 1.5 °C/W
Thermal Resistance, Junction to Ambient RθJA 62.5 °C/W

Instructions for Use:

  1. Handling Precautions:

    • The FB38N20D is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and assembly.
    • Avoid exposing the device to temperatures outside its specified operating range.
  2. Mounting:

    • Ensure proper heat sinking to maintain the junction temperature within the specified limits.
    • Use thermal compound between the device and the heatsink to improve thermal conductivity.
  3. Biasing:

    • Apply the gate voltage (VGS) carefully to avoid exceeding the maximum ratings.
    • Ensure the gate-source voltage is within the recommended range to prevent damage or reduced performance.
  4. Operation:

    • Do not exceed the maximum drain-source voltage (VDS) to prevent breakdown.
    • Keep the continuous drain current (ID) within the specified limits to avoid overheating and potential failure.
    • For pulse operation, ensure the pulse duration and peak current do not exceed the specified values.
  5. Storage:

    • Store the device in a dry, cool environment within the specified storage temperature range.
    • Protect the device from moisture and physical damage during storage and transportation.
  6. Testing:

    • Use appropriate test equipment and methods to verify the device parameters.
    • Follow safety guidelines when testing high-voltage and high-current circuits.
  7. Soldering:

    • Use a soldering iron with a controlled temperature and avoid overheating the device during soldering.
    • Follow the recommended soldering profile to ensure reliable connections without damaging the device.
  8. Troubleshooting:

    • If the device fails to operate correctly, check for proper biasing, correct connections, and thermal management.
    • Refer to the datasheet and application notes for additional troubleshooting tips and recommendations.
(For reference only)

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