Instructions for Use:

1. Handling Precautions:

   • Avoid exceeding the maximum ratings listed to prevent damage.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure the device is mounted on a suitable heatsink if operating at high power levels.
   • Follow recommended PCB layout guidelines to ensure optimal performance and thermal management.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified range to control the drain current (I_D).
   • Ensure the gate is properly biased to avoid excessive gate leakage current.

4. Operating Conditions:

   • Operate the device within the recommended temperature range to avoid thermal runaway.
   • Monitor the junction temperature (T_j) to ensure it does not exceed the maximum rating.

5. Testing:

   • Use a constant current source or a suitable load to test the device under controlled conditions.
   • Verify the transconductance (g_fs) and other parameters using standard test equipment.

6. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Keep the device in its original packaging until ready for use to protect against static damage.