Specifications
SKU: 11535092
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Drain-Source Voltage | VDS | -500 | - | -1000 | V |
Gate-Source Voltage | VGS | -20 | - | 20 | V |
Drain Current | ID | - | - | 10 | A |
Gate Threshold Voltage | VGS(th) | 2 | - | 4 | V |
Transconductance | gfs | 1.5 | - | 3.5 | S |
Input Capacitance | Ciss | - | 1000 | - | pF |
Output Capacitance | Coss | - | 300 | - | pF |
Reverse Transfer Capacitance | Crss | - | 150 | - | pF |
Junction Temperature | TJ | -55 | - | 150 | °C |
Storage Temperature | TSTG | -55 | - | 150 | °C |
Instructions for Use:
Handling Precautions:
- Handle the 2SK683 with care to avoid damage to the pins and the semiconductor structure.
- Use appropriate ESD (Electrostatic Discharge) protection measures to prevent damage from static electricity.
Mounting:
- Ensure that the mounting surface is clean and flat to ensure good thermal contact.
- Apply a suitable thermal compound between the device and the heatsink to enhance heat dissipation.
Biasing:
- The gate-source voltage (VGS) should be kept within the specified limits to avoid damaging the device.
- The drain current (ID) should not exceed the maximum rating to prevent overheating and potential failure.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it stays within the safe operating range.
- Use a heatsink if necessary to maintain the device temperature within the specified limits.
Testing:
- When testing the device, use a low current initially to verify proper operation before increasing the load.
- Ensure all connections are secure and correctly wired to avoid short circuits or incorrect biasing.
Storage:
- Store the 2SK683 in a dry, cool place away from direct sunlight and extreme temperatures.
- Keep the device in its original packaging until ready for use to protect it from environmental factors.
Inquiry - 2SK683