Name: IRFP450LCPBF
Availability: InStock

IRFP450LCPBF

Category: Transistors, Bipolar transistors

Specifications

SKU: 11535806

BUY IRFP450LCPBF https://www.utsource.net/itm/p/11535806.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Drain-Source Voltage	V_DS	-	-	500	V
Gate-Source Voltage	V_GS	-20	-	20	V
Continuous Drain Current	I_D	-	10	-	A	T_C = 25°C
Pulse Drain Current	I_D(p)	-	30	-	A	t_p = 10 ms, I_G = 10 A
Power Dissipation	P_T	-	-	160	W	T_C = 25°C
Junction Temperature	T_J	-	-	175	°C
Storage Temperature	T_STG	-55	-	150	°C
Thermal Resistance	R_θJC	-	0.8	-	°C/W	Junction to Case
Input Capacitance	C_iss	-	2200	-	pF	V_DS = 25 V, f = 1 MHz
Output Capacitance	C_oss	-	110	-	pF	V_DS = 25 V, f = 1 MHz
Reverse Transfer Capacitance	C_rss	-	120	-	pF	V_DS = 25 V, f = 1 MHz
Turn-On Delay Time	t_d(on)	-	150	-	ns	I_D = 10 A, V_GS = 15 V, V_DS = 250 V
Rise Time	t_r	-	90	-	ns	I_D = 10 A, V_GS = 15 V, V_DS = 250 V
Turn-Off Delay Time	t_d(off)	-	100	-	ns	I_D = 10 A, V_GS = 15 V, V_DS = 250 V
Fall Time	t_f	-	120	-	ns	I_D = 10 A, V_GS = 15 V, V_DS = 250 V

Mounting and Handling:
- Ensure proper heat sinking to manage power dissipation.
- Handle with care to avoid damage to the leads and the die.
Biasing:
- Apply the gate-source voltage (V_GS) within the specified range to avoid gate oxide breakdown.
- Ensure the drain-source voltage (V_DS) does not exceed the maximum rating to prevent device failure.
Current Limiting:
- Do not exceed the continuous drain current (I_D) or pulse drain current (I_D(p)) ratings.
- Use appropriate current limiting resistors if necessary.
Thermal Management:
- Monitor the junction temperature (T_J) to ensure it remains below the maximum rating.
- Use thermal paste and heatsinks to improve heat dissipation.
Storage:
- Store the device in a dry, cool place within the storage temperature range (T_STG).
Testing:
- Test the device under controlled conditions to verify performance parameters.
- Use appropriate test equipment and methods to avoid damaging the device.
ESD Protection:
- Handle the device with ESD protection measures to prevent electrostatic discharge damage.
Soldering:
- Follow recommended soldering profiles to avoid thermal shock and damage to the device.

(For reference only)

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