Specifications
SKU: 11535912
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 2.7 | - | 3.6 | V | |
Standby Current | ISB | - | 1 | 5 | μA | |
Active Current | IOP | - | 10 | 30 | mA | |
Access Time | tACC | - | 70 | - | ns | |
Write Cycle Time | tWC | - | 5 | 10 | ms | |
Block Erase Time | tBE | - | 200 | 400 | ms | |
Chip Enable Setup Time | tCES | - | 10 | - | ns | |
Chip Enable Hold Time | tCEH | - | 10 | - | ns | |
Output Enable Setup Time | tOES | - | 10 | - | ns | |
Output Enable Hold Time | tOEH | - | 10 | - | ns | |
Write Enable Setup Time | tWES | - | 10 | - | ns | |
Write Enable Hold Time | tWEH | - | 10 | - | ns | |
Data Setup Time | tDS | - | 10 | - | ns | |
Data Hold Time | tDH | - | 5 | - | ns | |
Address Setup Time | tAS | - | 10 | - | ns | |
Address Hold Time | tAH | - | 5 | - | ns | |
Power-down Time | tPD | - | 10 | - | μs | |
Power-up Time | tPU | - | 10 | - | μs | |
High-Z Output Leakage | IZ | - | 1 | 5 | μA | |
Input Leakage Current | IIH | -1 | - | 1 | μA | |
Output Low Voltage | VOL | 0 | - | 0.4 | V | |
Output High Voltage | VOH | 2.4 | - | VCC | V |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.7V to 3.6V.
- The device operates with a typical standby current of 1 μA and an active current of 10 mA.
Timing Parameters:
- The access time (tACC) is 70 ns, which is the time required to read data from the memory.
- The write cycle time (tWC) is between 5 ms and 10 ms.
- The block erase time (tBE) ranges from 200 ms to 400 ms.
Control Signals:
- Proper setup and hold times for control signals (Chip Enable, Output Enable, Write Enable) must be observed to ensure reliable operation.
- For example, the chip enable setup time (tCES) and hold time (tCEH) are both 10 ns.
Data and Address Lines:
- Ensure that data and address lines meet the setup and hold time requirements to prevent data corruption.
- Data setup time (tDS) is 10 ns, and data hold time (tDH) is 5 ns.
Power Management:
- The power-down time (tPD) is 10 μs, and the power-up time (tPU) is also 10 μs.
- During power-down, the high-Z output leakage (IZ) should not exceed 5 μA.
Output Levels:
- The output low voltage (VOL) should not exceed 0.4V.
- The output high voltage (VOH) should be at least 2.4V and can go up to the supply voltage (VCC).
Handling and Storage:
- Handle the device with care to avoid electrostatic discharge (ESD) damage.
- Store the device in a dry environment to prevent moisture damage.
Programming:
- Follow the programming sequence specified in the device datasheet for writing and erasing operations.
- Ensure that the device is properly configured before performing any write or erase operations.
Inquiry - EN29LV320T-70TIP