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P82B96DP

Specifications

SKU: 11537135

BUY P82B96DP https://www.utsource.net/itm/p/11537135.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.0 - 5.5 V Operating supply voltage range
Operating Temperature Toper -40 - 125 °C Operating temperature range
Storage Temperature Tstg -65 - 150 °C Storage temperature range
Maximum Junction Temperature Tjmax - - 150 °C Maximum junction temperature
Output Current (Source) IOL - 10 20 mA Maximum output current when sourcing
Output Current (Sink) IOH -20 -10 - mA Maximum output current when sinking
Input Capacitance Cin - 10 - pF Input capacitance
Output Capacitance Cout - 10 - pF Output capacitance
Propagation Delay tpd - 10 20 ns Propagation delay time from input to output
Power Consumption PD - 50 100 mW Power dissipation at maximum load
ESD Rating HBM - - 2000 V Human Body Model Electrostatic Discharge Rating

Instructions for Using P82B96DP

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 2.0V to 5.5V.
    • Connect the VDD pin to a stable power source and the GND pin to the ground.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 125°C.
    • Store the device in an environment between -65°C and 150°C.
  3. Current Handling:

    • The device can source up to 20mA and sink up to 20mA per output.
    • Ensure that the load does not exceed these current limits to avoid damage.
  4. Capacitance:

    • The input and output capacitances are approximately 10pF each.
    • Account for these values when designing circuits to ensure stability and performance.
  5. Propagation Delay:

    • The typical propagation delay is 10ns, with a maximum of 20ns.
    • This delay should be considered in timing-critical applications.
  6. Power Dissipation:

    • The power consumption is typically 50mW and can go up to 100mW under maximum load conditions.
    • Ensure adequate heat dissipation if operating near the maximum power consumption.
  7. ESD Protection:

    • The device has an ESD rating of 2000V (HBM).
    • Handle the device with care to avoid static discharge, especially during handling and installation.
  8. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) procedures for mounting and soldering.
    • Use appropriate soldering temperatures and profiles to avoid thermal stress on the device.
  9. Testing and Verification:

    • After assembly, verify the functionality of the device by testing its input and output signals.
    • Use a multimeter or oscilloscope to check for proper operation and signal integrity.
  10. Storage and Handling:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Handle the device with anti-static wrist straps and use static-safe packaging materials.

By following these parameters and instructions, you can ensure reliable and efficient operation of the P82B96DP.

(For reference only)

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