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Specifications
SKU: 11540295
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (VDD) | Operating supply voltage | 4.75 | 5.0 | 5.25 | V |
| Output Voltage Range | Voltage range at the output | 0 | - | VDD | V |
| Reference Voltage (VREF) | Reference voltage for DAC operation | 0 | - | VDD | V |
| Digital Input Voltage (VIL, VIH) | Input logic low/high voltage | 0 | 2.0 | VDD | V |
| Digital Input Current (IIL, IIH) | Input current at logic low/high | -1.0 | - | 0.4 | mA |
| Analog Output Impedance (ZOUT) | Output impedance of the DAC | - | 30 | - | Ω |
| Settling Time (tS) | Time to settle within 1 LSB | - | 10 | - | μs |
| Power Dissipation (PD) | Maximum power dissipation | - | 150 | - | mW |
| Operating Temperature (TA) | Ambient operating temperature | -40 | - | 85 | °C |
| Storage Temperature (TSTG) | Storage temperature range | -65 | - | 150 | °C |
Instructions for Using AD7502JN:
Power Supply:
- Connect the VDD pin to a stable 5V power supply.
- Ensure the supply voltage is within the specified range (4.75V to 5.25V).
Reference Voltage:
- Connect the VREF pin to a reference voltage source. The reference voltage can be between 0V and VDD.
- For maximum output range, connect VREF to VDD.
Digital Inputs:
- Apply digital input signals to the data pins (D0-D7).
- Ensure the input voltages are within the specified range (0V to VDD).
- The input current should not exceed the specified limits (-1.0mA to 0.4mA).
Analog Output:
- The analog output (VOUT) will be proportional to the digital input code and the reference voltage.
- The output impedance is approximately 30Ω, so ensure the load resistance is much higher to avoid significant voltage drop.
Settling Time:
- Allow the DAC to settle for at least 10μs after changing the digital input to ensure the output has stabilized within 1 LSB.
Temperature Considerations:
- Operate the device within the specified ambient temperature range (-40°C to 85°C).
- Store the device within the storage temperature range (-65°C to 150°C).
Power Dissipation:
- Ensure the power dissipation does not exceed 150mW to prevent overheating and potential damage to the device.
Layout and Grounding:
- Use proper PCB layout techniques to minimize noise and interference.
- Ensure a good ground connection to maintain signal integrity.
Handling:
- Handle the device with care to avoid static discharge and physical damage.
- Follow ESD (Electrostatic Discharge) precautions during handling and installation.
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