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DA82562ET

Specifications

SKU: 11540365

BUY DA82562ET https://www.utsource.net/itm/p/11540365.html

Parameter Symbol Min Typical Max Unit Description
Supply Voltage VCC 2.7 - 5.5 V Operating supply voltage range
Output Current (Per Channel) IOUT - 100 150 mA Maximum output current per channel
Operating Temperature TOPR -40 - 85 °C Operating temperature range
Storage Temperature TSTG -55 - 150 °C Storage temperature range
Power Dissipation PD - - 700 mW Maximum power dissipation (per channel)
Thermal Resistance (θJA) θJA - 60 - °C/W Junction-to-ambient thermal resistance
Rise Time tr - 100 - ns Rise time from 10% to 90% of output level
Fall Time tf - 100 - ns Fall time from 90% to 10% of output level
Propagation Delay tpd - 25 - ns Propagation delay from input to output
Input Capacitance Cin - 10 - pF Input capacitance
Output Capacitance Cout - 5 - pF Output capacitance
Quiescent Current IQ - 10 - μA Quiescent current
Short-Circuit Current ISCC - 150 - mA Maximum short-circuit current (per channel)
Channel-to-Channel Skew tskew - 5 - ns Maximum skew between channels

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (2.7V to 5.5V).
    • Use appropriate decoupling capacitors (e.g., 0.1μF and 10μF) close to the power pins to stabilize the supply.
  2. Output Current:

    • Do not exceed the maximum output current of 150mA per channel to avoid damage.
    • For continuous operation, ensure the power dissipation does not exceed 700mW per channel.
  3. Temperature:

    • Operate the device within the specified temperature range (-40°C to 85°C).
    • Store the device within the storage temperature range (-55°C to 150°C).
  4. Signal Timing:

    • Consider the rise and fall times when designing your circuit to ensure proper signal integrity.
    • Account for the propagation delay in timing-sensitive applications.
  5. Short-Circuit Protection:

    • The device has built-in short-circuit protection, but do not rely on it for extended periods as it can lead to overheating.
  6. Capacitance:

    • Take into account the input and output capacitance values when designing your PCB layout to minimize parasitic effects.
  7. Thermal Management:

    • Ensure adequate heat dissipation by providing sufficient PCB area or using heatsinks if necessary.
    • Monitor the junction temperature to stay below the maximum thermal limits.
  8. Quiescent Current:

    • The quiescent current is low, making the device suitable for battery-powered applications.
  9. Channel Skew:

    • In multi-channel applications, ensure that the channel-to-channel skew is within acceptable limits for your specific use case.

By following these parameters and instructions, you can ensure reliable and efficient operation of the DA82562ET.

(For reference only)

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