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Specifications
SKU: 11542561
| Parameter | Description | Value |
|---|---|---|
| Device | Flash Memory | S29GL256P10TFI010 |
| Manufacturer | Spansion (now part of Cypress Semiconductor) | |
| Package Type | TFBGA (Thin Fine Pitch Ball Grid Array) | 100-pin |
| Density | Storage Capacity | 256 Mbit (32 MB) |
| Voltage Range (Vcc) | Supply Voltage | 2.7 V to 3.6 V |
| Operating Temperature | Industrial Temperature Range | -40°C to +85°C |
| Data Retention | Data Retention Time | 20 years |
| Endurance | Program/Erase Cycles | 100,000 cycles |
| Access Time | Read Access Time (tRAC) | 70 ns (typical) |
| Write Cycle Time | Page Program Time | 2 ms (typical) |
| Erase Time | Block Erase Time | 4 ms (typical) |
| Data Bus Width | Data Bus Width | 8-bit or 16-bit |
| Organization | Memory Organization | 32M x 8 or 16M x 16 |
| Programming Algorithm | Programming Method | Byte, Page, and Block Programming |
| Protection Features | Security Features | Block Lock, Software Write Protect |
| Power Consumption | Active Read Current (Icc) | 35 mA (max) at 3.6 V |
| Standby Current | Standby Current (Icc) | 10 μA (max) at 3.6 V |
| Deep Power-Down Mode | Deep Power-Down Current (IDD5) | 1 μA (max) at 3.6 V |
| Package Dimensions | Package Size | 12 mm x 12 mm x 1.0 mm |
| RoHS Compliance | RoHS Compliant | Yes |
Instructions for Use
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 2.7 V to 3.6 V.
- Connect the ground (GND) pin to a stable ground reference.
Address and Data Lines:
- Connect the address lines (A0-A23) to the appropriate address bus.
- Connect the data lines (DQ0-DQ7 or DQ0-DQ15) to the data bus based on the selected bus width (8-bit or 16-bit).
Control Signals:
- Connect the chip enable (CE#), output enable (OE#), write enable (WE#), and byte lane select (BLS#) signals as required by your system design.
- For 16-bit operation, connect the BLS# signal to control the upper and lower byte lanes.
Programming and Erasing:
- Use the provided programming algorithms for byte, page, and block programming.
- Perform block erase operations using the specified block erase commands.
- Ensure that the device is properly protected against accidental writes by using the block lock and software write protect features.
Power Management:
- Utilize the deep power-down mode to reduce power consumption during idle periods by asserting the deep power-down enable (DPD#) signal.
Temperature Considerations:
- Operate the device within the industrial temperature range of -40°C to +85°C to ensure reliable performance.
Handling Precautions:
- Handle the device with care to avoid static discharge and physical damage.
- Follow the recommended soldering and reflow profiles to ensure proper mounting on the PCB.
Testing and Validation:
- Perform thorough testing and validation of the device in your application to ensure it meets all performance and reliability requirements.
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