Share:


NJW1302G NJW3281G

Specifications

SKU: 11547122

BUY NJW1302G NJW3281G https://www.utsource.net/itm/p/11547122.html

Parameter NJW1302G NJW3281G
Type DC-DC Converter DC-DC Converter
Input Voltage Range (VIN) 2.7V to 5.5V 2.7V to 5.5V
Output Voltage (VOUT) 1.8V, 2.5V, 3.0V, 3.3V 1.8V, 2.5V, 3.0V, 3.3V
Output Current (IOUT) 300mA 600mA
Switching Frequency (fSW) 1.2MHz 1.2MHz
Efficiency (η) Up to 95% Up to 95%
Quiescent Current (IQ) 30μA 30μA
Shutdown Current (ISD) 1μA 1μA
Package SOT-23-5 SOT-23-5
Operating Temperature Range (Tamb) -40°C to +85°C -40°C to +85°C
Protection Features Overcurrent Protection, Thermal Shutdown Overcurrent Protection, Thermal Shutdown

Instructions for Use

NJW1302G

  1. Circuit Configuration:

    • Connect the input voltage (VIN) to the VIN pin.
    • Connect the output voltage (VOUT) to the VOUT pin.
    • Ground the GND pin.
    • Connect the FB pin to a voltage divider to set the output voltage.
    • Connect the EN pin to a control signal or leave it open for continuous operation.
  2. Capacitors:

    • Use a 1μF ceramic capacitor for the input (CIN) and a 1μF ceramic capacitor for the output (COUT).
  3. Inductor:

    • Use a 2.2μH inductor for optimal performance.
  4. Thermal Management:

    • Ensure adequate heat dissipation by using a PCB with good thermal vias and copper planes.
  5. Layout Considerations:

    • Keep the input and output capacitors as close as possible to the IC.
    • Minimize the loop area for the high-frequency switching currents.

NJW3281G

  1. Circuit Configuration:

    • Connect the input voltage (VIN) to the VIN pin.
    • Connect the output voltage (VOUT) to the VOUT pin.
    • Ground the GND pin.
    • Connect the FB pin to a voltage divider to set the output voltage.
    • Connect the EN pin to a control signal or leave it open for continuous operation.
  2. Capacitors:

    • Use a 1μF ceramic capacitor for the input (CIN) and a 1μF ceramic capacitor for the output (COUT).
  3. Inductor:

    • Use a 2.2μH inductor for optimal performance.
  4. Thermal Management:

    • Ensure adequate heat dissipation by using a PCB with good thermal vias and copper planes.
  5. Layout Considerations:

    • Keep the input and output capacitors as close as possible to the IC.
    • Minimize the loop area for the high-frequency switching currents.

Additional Notes:

  • Both devices are designed for low-power applications and offer high efficiency and small form factors.
  • Always refer to the datasheet for detailed specifications and application notes.
(For reference only)

 Inquiry - NJW1302G NJW3281G