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JS28F320J3F75A

Specifications

SKU: 11552619

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Parameter Description Value Unit
Device Type Flash Memory 32 Mbit (4 M x 8) -
Package BGA 56-Pin -
Operating Voltage VCC Supply Voltage 2.7 to 3.6 V
Operating Temperature Industrial Temperature Range -40 to +85 °C
Programming Voltage VPP Supply Voltage 2.7 to 3.6 V
Access Time tACC 70 ns
Page Size Page Programming 256 bytes
Sector Size Sector Erase 64 Kbytes -
Block Size Block Erase 128 Kbytes -
Chip Size Chip Erase Full Chip -
Programming Time Page Program 1.5 ms
Erase Time Sector Erase 15 ms
Erase Time Block Erase 30 ms
Erase Time Chip Erase 300 ms
Endurance Write/Erase Cycles 100,000 -
Data Retention Data Retention 20 years -
Standby Current VCC = 3.0V, VPP = 0V 5 μA
Active Current Read Operation at 3.0V 20 mA

Instructions for Use:

  1. Power Supply:

    • Ensure that the VCC supply voltage is within the range of 2.7V to 3.6V.
    • The VPP supply voltage should also be within the same range.
  2. Temperature Range:

    • Operate the device within the industrial temperature range of -40°C to +85°C.
  3. Programming:

    • Use the page programming method with a page size of 256 bytes.
    • The programming time for a page is 1.5 milliseconds.
  4. Erasing:

    • Erase operations can be performed at the sector level (64 Kbytes), block level (128 Kbytes), or chip level (full chip).
    • Sector erase takes 15 milliseconds, block erase takes 30 milliseconds, and chip erase takes 300 milliseconds.
  5. Endurance and Data Retention:

    • The device supports up to 100,000 write/erase cycles.
    • Data retention is guaranteed for 20 years under typical operating conditions.
  6. Current Consumption:

    • In standby mode, the current consumption is 5 μA at 3.0V.
    • During active read operations, the current consumption is 20 mA at 3.0V.
  7. Pin Configuration:

    • Refer to the datasheet for the specific pin configuration and functions of the 56-Pin BGA package.
  8. Handling:

    • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
  9. Testing:

    • Before integrating the device into your system, perform functional tests to ensure it meets the required specifications.

For detailed information and additional specifications, refer to the official datasheet provided by the manufacturer.

(For reference only)

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