Specifications
SKU: 11553457
Parameter | Description | Value |
---|---|---|
Device Family | Device family | Virtex-4 LX |
Device Type | Specific device type | XC4VLX25 |
Package | Package type | FFG668 (FineLine BGA) |
Speed Grade | Speed grade | -11 |
I/O Banks | Number of I/O banks | 17 |
Configuration Modes | Supported configuration modes | Master/Slave Serial, Master/Slave Parallel, SelectMAP, JTAG |
Configuration Voltage | Configuration voltage | 1.2V or 3.3V |
Configuration Flash Memory | On-chip flash memory for configuration | No |
Operating Temperature Range | Operating temperature range | -40°C to +100°C |
Supply Voltage (VCCINT) | Internal core supply voltage | 1.2V ± 0.06V |
Supply Voltage (VCCAUX) | Auxiliary supply voltage | 2.5V ± 0.25V |
Supply Voltage (VCCO) | I/O supply voltage | 1.2V, 1.5V, 1.8V, 2.5V, 3.3V |
Maximum Frequency (fMAX) | Maximum clock frequency for typical applications | Varies by design; check specific datasheet |
Number of Logic Cells | Number of logic cells | 25,000 |
Block RAM | Block RAM size | 1,080 Kb |
DSP Slices | Number of DSP slices | 50 |
I/O Pins | Number of I/O pins | 528 |
Configuration Pins | Number of configuration pins | 10 (for JTAG) |
Configuration Time | Typical configuration time | < 10 ms |
Power Consumption | Typical power consumption | Varies by design; check specific datasheet |
JTAG Boundary-Scan | Support for JTAG boundary-scan | Yes |
Instructions for Use:
Power Supply Connections:
- Ensure that the correct supply voltages are applied to VCCINT (1.2V), VCCAUX (2.5V), and VCCO (as required by your I/O standards).
- Use decoupling capacitors close to the power pins to reduce noise and improve stability.
Configuration:
- Choose the appropriate configuration mode (Master/Slave Serial, Master/Slave Parallel, SelectMAP, JTAG).
- Follow the specific configuration sequence as outlined in the Xilinx Virtex-4 Configuration Guide.
- Ensure the configuration voltage (VCC_CFG) is set correctly (1.2V or 3.3V).
I/O Standards:
- Set the I/O standards for each bank according to your design requirements using the appropriate IOSTANDARD attribute in your HDL code or constraints file.
Thermal Management:
- Monitor the operating temperature to ensure it stays within the specified range (-40°C to +100°C).
- Use heatsinks or cooling solutions if necessary, especially for high-power designs.
JTAG Testing:
- Use the JTAG boundary-scan pins for testing and debugging.
- Ensure the TCK, TDI, TDO, and TMS pins are connected correctly for JTAG access.
Signal Integrity:
- Use proper PCB layout techniques to minimize signal integrity issues, such as controlled impedance traces and ground planes.
Clock Distribution:
- Utilize the global clock network for distributing high-frequency clocks to minimize skew and jitter.
- Use the BUFG (Global Buffer) primitives for clock distribution.
Design Entry and Synthesis:
- Use Xilinx ISE or Vivado for design entry, synthesis, and implementation.
- Follow best practices for HDL coding and constraint management to optimize performance and resource utilization.
Documentation:
- Refer to the Xilinx Virtex-4 User Guide and Data Sheet for detailed information on device-specific features and limitations.
- Consult the Xilinx Design Assistant and other online resources for troubleshooting and advanced design techniques.
Inquiry - XC4VLX25-11FFG668C