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XC4VLX25-11FFG668C

Specifications

SKU: 11553457

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Parameter Description Value
Device Family Device family Virtex-4 LX
Device Type Specific device type XC4VLX25
Package Package type FFG668 (FineLine BGA)
Speed Grade Speed grade -11
I/O Banks Number of I/O banks 17
Configuration Modes Supported configuration modes Master/Slave Serial, Master/Slave Parallel, SelectMAP, JTAG
Configuration Voltage Configuration voltage 1.2V or 3.3V
Configuration Flash Memory On-chip flash memory for configuration No
Operating Temperature Range Operating temperature range -40°C to +100°C
Supply Voltage (VCCINT) Internal core supply voltage 1.2V ± 0.06V
Supply Voltage (VCCAUX) Auxiliary supply voltage 2.5V ± 0.25V
Supply Voltage (VCCO) I/O supply voltage 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Maximum Frequency (fMAX) Maximum clock frequency for typical applications Varies by design; check specific datasheet
Number of Logic Cells Number of logic cells 25,000
Block RAM Block RAM size 1,080 Kb
DSP Slices Number of DSP slices 50
I/O Pins Number of I/O pins 528
Configuration Pins Number of configuration pins 10 (for JTAG)
Configuration Time Typical configuration time < 10 ms
Power Consumption Typical power consumption Varies by design; check specific datasheet
JTAG Boundary-Scan Support for JTAG boundary-scan Yes

Instructions for Use:

  1. Power Supply Connections:

    • Ensure that the correct supply voltages are applied to VCCINT (1.2V), VCCAUX (2.5V), and VCCO (as required by your I/O standards).
    • Use decoupling capacitors close to the power pins to reduce noise and improve stability.
  2. Configuration:

    • Choose the appropriate configuration mode (Master/Slave Serial, Master/Slave Parallel, SelectMAP, JTAG).
    • Follow the specific configuration sequence as outlined in the Xilinx Virtex-4 Configuration Guide.
    • Ensure the configuration voltage (VCC_CFG) is set correctly (1.2V or 3.3V).
  3. I/O Standards:

    • Set the I/O standards for each bank according to your design requirements using the appropriate IOSTANDARD attribute in your HDL code or constraints file.
  4. Thermal Management:

    • Monitor the operating temperature to ensure it stays within the specified range (-40°C to +100°C).
    • Use heatsinks or cooling solutions if necessary, especially for high-power designs.
  5. JTAG Testing:

    • Use the JTAG boundary-scan pins for testing and debugging.
    • Ensure the TCK, TDI, TDO, and TMS pins are connected correctly for JTAG access.
  6. Signal Integrity:

    • Use proper PCB layout techniques to minimize signal integrity issues, such as controlled impedance traces and ground planes.
  7. Clock Distribution:

    • Utilize the global clock network for distributing high-frequency clocks to minimize skew and jitter.
    • Use the BUFG (Global Buffer) primitives for clock distribution.
  8. Design Entry and Synthesis:

    • Use Xilinx ISE or Vivado for design entry, synthesis, and implementation.
    • Follow best practices for HDL coding and constraint management to optimize performance and resource utilization.
  9. Documentation:

    • Refer to the Xilinx Virtex-4 User Guide and Data Sheet for detailed information on device-specific features and limitations.
    • Consult the Xilinx Design Assistant and other online resources for troubleshooting and advanced design techniques.
(For reference only)

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