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THGBMDG5D1LBAIL

Specifications

SKU: 11556371

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Parameter Description Value
Product Name NAND Flash Memory THGBMDG5D1LBAIL
Memory Density Total Memory 64 Gb (8 GB)
Organization Number of Banks x Pages per Bank x Words per Page 2048 x 128 x 2048
Interface NAND Interface Type Toggle Mode 2.0
Supply Voltage VCC (Core Supply) 1.8V ± 0.1V
I/O Voltage VCCQ (I/O Supply) 1.8V ± 0.1V
Operating Temperature Range Industrial Temperature Range -40°C to +85°C
Data Retention Minimum Data Retention Time 10 years
Endurance Program/Erase Cycles 3,000 cycles
Access Time tR (Read Access Time) 50 ns
Write Time tPROG (Program Time for 1 Page) 400 μs
Erase Time tBERS (Block Erase Time) 2 ms
Package Package Type BGA
Package Size Package Dimensions 16 mm x 12 mm x 1.2 mm
Pin Count Number of Pins 80
Standards Compliance JEDEC Standards JESD218A, JESD84-B47

Instructions for Use

  1. Power Supply:

    • Ensure that the core supply (VCC) and I/O supply (VCCQ) are set to 1.8V ± 0.1V.
    • Power up the device before applying any signals.
  2. Signal Integrity:

    • Use proper decoupling capacitors near the power pins to ensure stable operation.
    • Ensure all signal lines are properly terminated to prevent reflections and signal integrity issues.
  3. Initialization:

    • After power-up, the device will be in the RESET state. Send the appropriate command sequence to initialize the device.
    • Refer to the device datasheet for specific initialization sequences.
  4. Command Sequence:

    • Use the correct command codes for read, write, and erase operations.
    • For example, the read command is typically 0x00, the program command is 0x80, and the block erase command is 0x60.
  5. Timing Parameters:

    • Adhere to the specified timing parameters such as access time, write time, and erase time to ensure reliable operation.
    • Use the provided timing diagrams in the datasheet to understand the timing relationships between commands and data transfers.
  6. Error Handling:

    • Monitor the status register to check for errors during operations.
    • Implement error correction mechanisms if necessary, especially for critical applications.
  7. Environmental Considerations:

    • Operate the device within the specified temperature range (-40°C to +85°C) to avoid damage or performance degradation.
    • Store the device in a dry, cool environment when not in use.
  8. Handling Precautions:

    • Handle the device with care to avoid mechanical damage.
    • Use ESD protection measures to prevent electrostatic discharge damage.
  9. Data Management:

    • Implement wear leveling algorithms to distribute writes evenly across the memory to maximize endurance.
    • Regularly back up important data to prevent loss due to data retention limits.
  10. Compliance:

    • Ensure that the device is used in compliance with all relevant standards and regulations.
    • Refer to the datasheet for detailed compliance information and guidelines.

For more detailed information, refer to the specific datasheet and application notes provided by the manufacturer.

(For reference only)

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