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EPM3256ATC144-10

Specifications

SKU: 11558487

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Parameter Description Value
Device Type Type of Device CPLD (Complex Programmable Logic Device)
Family Device Family MAX 3000A
Part Number Specific Part Number EPM3256ATC144-10
Package Package Type TQFP-144 (TC144)
Speed Grade Speed Grade -10 (10 ns)
I/O Pins Number of I/O Pins 128
Logic Cells Number of Logic Cells 2,560
Macrocells Number of Macrocells 3,256
Internal RAM Internal RAM Size 128 bits
Operating Voltage Supply Voltage Range 3.3V ± 5%
Operating Temperature Operating Temperature Range -40°C to +85°C
Configuration Memory Configuration Memory Type Non-Volatile (Flash)
Configuration Time Configuration Time < 1 ms (Typical)
JTAG Interface JTAG Support Yes
Programming Modes Programming Modes In-System Programming (ISP), ByteBlasterMV Compatible
Power Consumption Typical Power Consumption 100 mW (Active), 10 mW (Standby)
ESD Protection ESD Protection HBM: 2 kV, MM: 200 V
RoHS Compliance RoHS Compliance Yes

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage is within the specified range of 3.3V ± 5%.
    • Connect the VCC and GND pins appropriately to ensure stable power supply.
  2. Configuration:

    • Use the JTAG interface for programming and configuration.
    • Ensure that the configuration file is correctly generated using the appropriate software tools (e.g., Quartus II).
    • Follow the recommended programming sequence for In-System Programming (ISP).
  3. Input/Output Handling:

    • Configure the I/O pins as inputs or outputs based on your application requirements.
    • Ensure that input signals are within the valid logic levels for the device.
    • Use appropriate pull-up or pull-down resistors if necessary.
  4. Thermal Management:

    • Ensure adequate heat dissipation by providing sufficient airflow or heatsinking if required.
    • Monitor the temperature of the device to ensure it stays within the operating temperature range.
  5. ESD Precautions:

    • Handle the device with care to avoid ESD damage.
    • Use proper ESD protection equipment and follow best practices during handling and installation.
  6. Storage and Handling:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Follow the recommended storage conditions and handling guidelines provided by the manufacturer.
  7. Testing and Validation:

    • Perform thorough testing and validation of the device in your application to ensure reliable operation.
    • Use boundary-scan testing (JTAG) to verify the functionality of the device and the PCB.

For detailed specifications and additional information, refer to the datasheet and application notes provided by the manufacturer.

(For reference only)

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