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MC14066BCPG

Specifications

SKU: 11563194

BUY MC14066BCPG https://www.utsource.net/itm/p/11563194.html
IC MULTIPLEXER QUAD 1X1 14DIP
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 2.0 - 6.0 V
Operating Temperature TA -55 - 125 °C
Storage Temperature TSTG -65 - 150 °C
Input Voltage Range VI 0 - VCC V
Output Voltage Range VO 0 - VCC V
Quiescent Current IQ - 10 30 μA
Propagation Delay Time td - 18 50 ns @ VCC = 5V, TA = 25°C
Power Dissipation PD - - 100 mW
Input Capacitance CI - 8 - pF
Output Capacitance CO - 5 - pF
Input Leakage Current IIL -100 - 100 nA
Output Leakage Current IOL -100 - 100 nA

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect the VCC pin to the positive supply and the GND pin to the ground.
  2. Temperature Considerations:

    • The device can operate over a wide temperature range from -55°C to 125°C.
    • Store the device in temperatures between -65°C and 150°C.
  3. Input and Output Voltages:

    • The input voltage (VI) should be within the range of 0V to VCC.
    • The output voltage (VO) will also be within the range of 0V to VCC.
  4. Power Dissipation:

    • The maximum power dissipation (PD) is 100mW. Ensure adequate heat sinking if operating near this limit.
  5. Capacitance:

    • The input capacitance (CI) is typically 8pF, and the output capacitance (CO) is typically 5pF. These values should be considered when designing the circuit to avoid signal degradation.
  6. Leakage Current:

    • The input leakage current (IIL) and output leakage current (IOL) are both ±100nA. This should be accounted for in low-current applications.
  7. Propagation Delay:

    • The typical propagation delay time (td) is 18ns at VCC = 5V and TA = 25°C. This value can increase to 50ns under different conditions.
  8. Quiescent Current:

    • The quiescent current (IQ) is typically 10μA but can go up to 30μA. This is important for battery-operated devices.
  9. Handling Precautions:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures.
    • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.
  10. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.
(For reference only)

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