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STP14NK50ZFP,P14NK50ZFP

Specifications

SKU: 11564866

BUY STP14NK50ZFP,P14NK50ZFP https://www.utsource.net/itm/p/11564866.html

Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDS - 500 - V
Gate-Source Voltage VGS -20 - 20 V
Continuous Drain Current ID - 14 - A TC = 25°C
Pulse Drain Current ID(p) - 70 - A tp = 10ms, TC = 25°C
Power Dissipation PTOT - - 115 W TC = 25°C
Junction Temperature TJ - - 150 °C
Storage Temperature TSTG -55 - 150 °C
Thermal Resistance, Junction to Case RθJC - - 0.85 °C/W
Total Gate Charge QG - 90 - nC VGS = 15V
Input Capacitance Ciss - 1300 - pF VDS = 25V
Output Capacitance Coss - 170 - pF VDS = 25V
Reverse Transfer Capacitance Crss - 65 - pF VDS = 25V
On-State Resistance RDS(on) - 1.5 - Ω VGS = 10V, ID = 14A

Instructions for Use:

  1. Mounting and Handling:

    • Ensure proper heat sinking to maintain junction temperature within specified limits.
    • Handle with care to avoid damage to the device.
  2. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly.
    • Use appropriate gate drive circuits to ensure reliable operation.
  3. Thermal Management:

    • Monitor the junction temperature to prevent overheating.
    • Use thermal paste between the device and heat sink for better heat dissipation.
  4. Operating Conditions:

    • Do not exceed the maximum ratings for drain-source voltage, gate-source voltage, and continuous/pulse drain current.
    • Ensure the power dissipation is within the specified limit to avoid thermal runaway.
  5. Storage and Transportation:

    • Store in a dry, cool place to prevent moisture damage.
    • Follow ESD (Electrostatic Discharge) precautions during handling and installation.
  6. Testing:

    • Perform initial testing at low power levels to verify correct operation.
    • Regularly inspect the device for signs of wear or damage.

For detailed application notes and further information, refer to the datasheet provided by STMicroelectronics.

(For reference only)

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