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TC74AC10P

Specifications

SKU: 11566698

BUY TC74AC10P https://www.utsource.net/itm/p/11566698.html

Parameter Symbol Min Typical Max Unit Condition
Supply Voltage VCC 2.0 - 5.5 V -
Input Voltage VI 0 - VCC V -
Output Voltage (High) VOH - VCC - 0.4 VCC - 0.3 V IO = -4 mA, VCC = 4.5 V to 5.5 V
Output Voltage (Low) VOL 0 0.1 0.2 V IO = 16 mA, VCC = 4.5 V to 5.5 V
Input Leakage Current IIL -1 - 1 μA VI = 0 to VCC, VCC = 4.5 V to 5.5 V
Output Leakage Current IOL -1 - 1 μA VO = 0 to VCC, VCC = 4.5 V to 5.5 V
Propagation Delay Time tpd - 10 18 ns VCC = 5.0 V, VIH = VCC - 1.5 V, VIL = 0.8 V, fIN = 10 MHz
Power Dissipation PD - - 150 mW TA = 25°C
Operating Temperature TOP -40 - 85 °C -
Storage Temperature TSTG -65 - 150 °C -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0 V to 5.5 V.
    • Connect the ground (GND) pin to the system ground.
  2. Input Signals:

    • Input voltages should be between 0 V and VCC.
    • Avoid applying voltages outside this range to prevent damage to the device.
  3. Output Signals:

    • The output high voltage (VOH) will be close to VCC when the output is active high.
    • The output low voltage (VOL) will be close to 0 V when the output is active low.
    • Ensure the load current does not exceed the specified limits to avoid overheating or damage.
  4. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for the output to change state after the input changes. It is typically 10 ns at VCC = 5.0 V.
  5. Temperature Considerations:

    • The device is designed to operate within the temperature range of -40°C to 85°C.
    • Store the device in a temperature range of -65°C to 150°C to ensure long-term reliability.
  6. Power Dissipation:

    • The maximum power dissipation (PD) is 150 mW at 25°C ambient temperature.
    • Ensure adequate heat dissipation if operating near the maximum power dissipation limit.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper ESD (Electrostatic Discharge) handling procedures during assembly and testing.
(For reference only)

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