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A5973D013TR

Specifications

SKU: 11582431

BUY A5973D013TR https://www.utsource.net/itm/p/11582431.html

Parameter Symbol Min Typ Max Unit Notes
Supply Voltage Vcc 4.5 5 5.5 V
Operating Temperature Toper -40 125 °C
Storage Temperature Tstg -65 150 °C
Output Current (Per Channel) Iout 1.3 A
Maximum Power Dissipation Pd 1.2 W
Thermal Resistance (θJA) θJA 80 °C/W
Input Capacitance Cin 10 pF
Output Capacitance Cout 10 pF
Rise Time tr 100 ns
Fall Time tf 100 ns
Propagation Delay tpd 150 ns
Enable Input High Level Vih 2.0 5.5 V
Enable Input Low Level Vil 0 0.8 V

Instructions for Using A5973D013TR

  1. Power Supply:

    • Ensure the supply voltage is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations that can affect performance.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 125°C.
    • Store the device in an environment between -65°C and 150°C.
  3. Output Current:

    • The maximum output current per channel is 1.3A. Do not exceed this limit to prevent damage.
  4. Power Dissipation:

    • The maximum power dissipation is 1.2W. Ensure proper heat sinking or cooling if operating near this limit.
  5. Thermal Management:

    • The thermal resistance (θJA) is 80°C/W. Use a heatsink or other cooling methods to manage heat effectively.
  6. Capacitance:

    • The input and output capacitances are both 10pF. Consider these values when designing the circuit to ensure stability.
  7. Timing Parameters:

    • The rise and fall times are 100ns each. Ensure your system can handle these transition times.
    • The propagation delay is 150ns. Account for this delay in your timing calculations.
  8. Enable Input:

    • The enable input high level (Vih) should be between 2.0V and 5.5V.
    • The enable input low level (Vil) should be between 0V and 0.8V.
  9. Handling and Storage:

    • Handle the device with care to avoid static discharge and physical damage.
    • Store the device in a dry, cool place to prevent moisture-related issues.
  10. Schematic and Layout:

    • Follow recommended PCB layout guidelines to minimize noise and improve performance.
    • Place decoupling capacitors close to the power pins to filter out noise.
  11. Testing and Validation:

    • Test the device under various conditions to ensure it meets the specified parameters.
    • Validate the design using appropriate test equipment and procedures.
(For reference only)

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