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TC74HC14AFN

Specifications

SKU: 11583731

BUY TC74HC14AFN https://www.utsource.net/itm/p/11583731.html

Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage VCC 2.0 - 6.0 V
Input Low Voltage VIL - 0.8 - V VCC = 4.5V
Input High Voltage VIH - 2.0 - V VCC = 4.5V
Output Low Voltage VOL - 0.1 0.4 V IOL = 4mA, VCC = 4.5V
Output High Voltage VOH 2.4 - - V IOH = -0.4mA, VCC = 4.5V
Propagation Delay Time tpd - 9 22 ns VCC = 4.5V, VI = VCC/2, tA = 25°C
Power Dissipation PD - - 100 mW TA = 25°C
Operating Temperature TA -40 - 85 °C
Storage Temperature TSTG -55 - 150 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0V to 6.0V to avoid damage to the device.
  2. Input Voltage Levels:

    • For reliable operation, input voltages should be below 0.8V for a low logic level and above 2.0V for a high logic level when VCC is 4.5V.
  3. Output Voltage Levels:

    • The output will be low (VOL) when the input is high, typically around 0.1V to 0.4V.
    • The output will be high (VOH) when the input is low, typically around 2.4V or higher.
  4. Propagation Delay (tpd):

    • The propagation delay time is the time it takes for the output to change state after the input changes. It is typically 9ns with a maximum of 22ns at 4.5V and 25°C.
  5. Power Dissipation (PD):

    • The maximum power dissipation is 100mW at 25°C. Ensure proper heat dissipation if operating near this limit.
  6. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -55°C to 150°C.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage the IC.
    • Store the device in a dry, cool place within the specified storage temperature range.
  8. Mounting and Soldering:

    • Follow standard soldering practices to ensure reliable connections.
    • Avoid overheating during soldering, as excessive heat can damage the device.
  9. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.
(For reference only)

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