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EPM7192EQC160-15

Specifications

SKU: 11584089

BUY EPM7192EQC160-15 https://www.utsource.net/itm/p/11584089.html

Parameter Description Value
Device Device Type EPM7192EQC160-15
Package Package Type 160-Pin Quad Flat Pack (QFP)
Speed Grade Maximum Operating Frequency 150 MHz
Logic Cells Number of Logic Cells 1,920
I/O Pins Number of I/O Pins 132
Internal RAM Internal RAM Size 480 bits
Programming Method Programming Technology Electrically Erasable (EE)
Power Supply VCC (Core Voltage) 3.3V ± 0.3V
I/O Voltage VCCIO (I/O Voltage) 3.3V ± 0.3V
Operating Temperature Industrial Temperature Range -40°C to +85°C
Standby Current Standby Current (Typical) 10 μA
Active Current Active Current (Typical) 100 mA
Configuration Memory Configuration Memory Type Non-Volatile
Configuration Time Configuration Time (Typical) 10 ms
Package Pinout Pin 1 Location Top Left Corner
Pin 1 Indicator Pin 1 Indicator Dot or Notch
ESD Protection Human Body Model (HBM) 2000 V
Lead Finish Lead Finish Matte Tin
RoHS Compliance RoHS Compliant Yes

Instructions for Use

  1. Power Supply:

    • Ensure that the core voltage (VCC) is set to 3.3V ± 0.3V.
    • The I/O voltage (VCCIO) should also be set to 3.3V ± 0.3V.
  2. Configuration:

    • Program the device using the appropriate programming software and hardware.
    • Configuration time is typically 10 ms.
  3. Handling:

    • Handle the device with care to avoid ESD damage. Use proper ESD protection measures.
    • Identify Pin 1 using the dot or notch indicator on the package.
  4. Operation:

    • Operate the device within the specified temperature range (-40°C to +85°C).
    • Monitor the active current to ensure it does not exceed 100 mA.
  5. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Follow the recommended storage conditions provided by the manufacturer.
  6. Soldering:

    • Use a reflow soldering process with a peak temperature of 230°C ± 10°C.
    • Ensure that the soldering process complies with the lead-free (RoHS) requirements.
  7. Testing:

    • Perform functional testing after soldering to ensure proper operation.
    • Verify the configuration and functionality of the device using the appropriate test equipment.
(For reference only)

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