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HM6264LP-10

Specifications

SKU: 11584508

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Parameter Description Value
Device Type 8K x 8 CMOS Static RAM -
Supply Voltage (Vcc) Operating Voltage Range 4.5V to 5.5V
Data Retention Voltage (Vcc) Data Retention Voltage Range 2.7V to 5.5V
Access Time (tAC) Access Time at Vcc = 5V, TA = 25°C 100ns (max)
Output Enable (OE) Active Low Input -
Chip Select (CE) Active Low Input -
Write Enable (WE) Active Low Input -
Output Drive Capability Output Current per Pin ±10mA
Standby Current (ICC) Standby Current at Vcc = 5V, CE = High 10μA (max)
Active Current (ICC) Active Current at Vcc = 5V, f = 10MHz 25mA (max)
Package Type Plastic Dual In-Line Package (PDIP) / Ceramic Dual In-Line Package (CDIP) -
Operating Temperature Range (TA) Industrial Grade -40°C to +85°C
Storage Temperature Range (TSTG) Storage Temperature -65°C to +150°C
Lead Finish Lead-Free (RoHS Compliant) -

Instructions for Use

  1. Power Supply:

    • Connect Vcc to a stable 5V supply.
    • Connect GND to the ground.
  2. Address Lines (A0-A12):

    • Connect the address lines to the appropriate address bus of the microcontroller or CPU.
  3. Data Lines (D0-D7):

    • Connect the data lines to the data bus of the microcontroller or CPU.
  4. Control Signals:

    • Chip Select (CE): Set CE low to enable the device. When CE is high, the device is in standby mode.
    • Output Enable (OE): Set OE low to enable data output. When OE is high, the outputs are in high-impedance state.
    • Write Enable (WE): Set WE low to write data to the memory. When WE is high, the device is in read mode.
  5. Timing Considerations:

    • Ensure that the access time (tAC) is respected to avoid data corruption. The maximum access time is 100ns at 5V and 25°C.
    • The setup and hold times for address and control signals should be within the specified limits to ensure reliable operation.
  6. Power-On/Reset:

    • After power-on, it is recommended to perform a reset or initialization sequence to ensure the device is in a known state.
  7. Handling Precautions:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry, cool place to prevent moisture damage.
  8. Environmental Considerations:

    • Operate the device within the specified temperature range to ensure reliable performance.
    • Store the device within the storage temperature range to prevent damage.
  9. RoHS Compliance:

    • The device is RoHS compliant and lead-free. Ensure that the soldering process is compatible with lead-free components.
(For reference only)

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