Specifications
SKU: 11612517
Parameter | Description | Value |
---|---|---|
Part Number | Full part number | ME8204BM6G |
Type | Type of component | Memory |
Technology | Technology used | DDR4 SDRAM |
Capacity | Total memory capacity | 64 Gb (8 GB) |
Organization | Internal organization | x8/x16 |
Voltage (VDD, VDDQ) | Operating voltage | 1.2V ± 0.06V |
Data Rate | Data transfer rate | 2133 MT/s |
CAS Latency (CL) | CAS latency | 15 |
RAS# to CAS# Delay (tRCD) | RAS to CAS delay | 15 cycles |
Row Precharge Time (tRP) | Row precharge time | 15 cycles |
Row Active Time (tRAS) | Minimum active to precharge delay | 35 cycles |
Refresh Cycle Time (tRFC) | Refresh cycle time | 350 ns |
Package | Package type | BGA |
Operating Temperature | Operating temperature range | -40°C to 105°C |
Storage Temperature | Storage temperature range | -65°C to 150°C |
RoHS Compliance | RoHS compliance | Yes |
Instructions for Use:
Power Supply:
- Ensure that the supply voltages (VDD and VDDQ) are within the specified range of 1.2V ± 0.06V.
- Use decoupling capacitors close to the power pins to minimize noise.
Signal Integrity:
- Use controlled impedance traces for high-speed signals to maintain signal integrity.
- Terminate differential pairs and high-frequency signals as per the datasheet recommendations.
Timing Parameters:
- Configure the memory controller to match the timing parameters (CL, tRCD, tRP, tRAS, tRFC) specified in the table.
- Ensure that the memory controller supports the data rate of 2133 MT/s.
Thermal Management:
- Provide adequate cooling to keep the operating temperature within the specified range (-40°C to 105°C).
- Use heat sinks or thermal vias if necessary to dissipate heat effectively.
Handling:
- Handle the component with care to avoid damage from electrostatic discharge (ESD).
- Follow proper ESD protection procedures during assembly and testing.
Testing:
- Perform initial testing at room temperature to verify basic functionality.
- Conduct extended tests at the full operating temperature range to ensure reliability.
Storage:
- Store the component in a dry, cool place within the storage temperature range (-65°C to 150°C).
- Protect the component from moisture and physical damage during storage.
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