Specifications
SKU: 11612524
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | VCC | 2.0 | 5.0 | 6.0 | V |
Operating Temperature | TOPR | -40 | - | 85 | °C |
Storage Temperature | TSTG | -65 | - | 150 | °C |
Input High Voltage | VIH | 2.0 | 3.5 | 5.5 | V |
Input Low Voltage | VIL | 0.0 | 1.5 | 2.5 | V |
Output High Voltage | VOH | 2.4 | 4.5 | 5.5 | V |
Output Low Voltage | VOL | 0.0 | 0.4 | 0.5 | V |
Quiescent Current | ICC | - | 10 | 25 | μA |
Output Sink Current | IOL | - | 4.0 | 20.0 | mA |
Output Source Current | IOH | - | -0.4 | -2.0 | mA |
Propagation Delay Time | tpd | 6 | 12 | 20 | ns |
Minimum Pulse Width | tpw(min) | 20 | - | - | ns |
Maximum Pulse Width | tpw(max) | - | - | 1000 | ns |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V to avoid damage to the device.
Operating Temperature:
- The device operates reliably between -40°C and 85°C. Ensure it is not exposed to temperatures outside this range during operation.
Storage Temperature:
- Store the device between -65°C and 150°C to prevent degradation or damage.
Input Voltages:
- For reliable operation, input high voltage (VIH) should be at least 2.0V and input low voltage (VIL) should be no more than 2.5V.
Output Voltages:
- The output high voltage (VOH) should be at least 2.4V and the output low voltage (VOL) should be no more than 0.5V.
Current Ratings:
- The quiescent current (ICC) should typically be around 10μA.
- The output sink current (IOL) can be up to 20mA.
- The output source current (IOH) can be up to -2.0mA.
Timing Parameters:
- The propagation delay time (tpd) should be between 6ns and 20ns.
- The minimum pulse width (tpw(min)) should be at least 20ns.
- The maximum pulse width (tpw(max)) should not exceed 1000ns.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
Mounting:
- Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
- Use appropriate heat sinks if necessary to manage thermal dissipation.
Testing:
- Test the device under typical operating conditions to ensure it meets the specified parameters.
- Refer to the datasheet for detailed test procedures and recommended test circuits.
Inquiry - SM74HC123DR