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SM74HC123DR

Specifications

SKU: 11612524

BUY SM74HC123DR https://www.utsource.net/itm/p/11612524.html

Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 2.0 5.0 6.0 V
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -65 - 150 °C
Input High Voltage VIH 2.0 3.5 5.5 V
Input Low Voltage VIL 0.0 1.5 2.5 V
Output High Voltage VOH 2.4 4.5 5.5 V
Output Low Voltage VOL 0.0 0.4 0.5 V
Quiescent Current ICC - 10 25 μA
Output Sink Current IOL - 4.0 20.0 mA
Output Source Current IOH - -0.4 -2.0 mA
Propagation Delay Time tpd 6 12 20 ns
Minimum Pulse Width tpw(min) 20 - - ns
Maximum Pulse Width tpw(max) - - 1000 ns

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V to avoid damage to the device.
  2. Operating Temperature:

    • The device operates reliably between -40°C and 85°C. Ensure it is not exposed to temperatures outside this range during operation.
  3. Storage Temperature:

    • Store the device between -65°C and 150°C to prevent degradation or damage.
  4. Input Voltages:

    • For reliable operation, input high voltage (VIH) should be at least 2.0V and input low voltage (VIL) should be no more than 2.5V.
  5. Output Voltages:

    • The output high voltage (VOH) should be at least 2.4V and the output low voltage (VOL) should be no more than 0.5V.
  6. Current Ratings:

    • The quiescent current (ICC) should typically be around 10μA.
    • The output sink current (IOL) can be up to 20mA.
    • The output source current (IOH) can be up to -2.0mA.
  7. Timing Parameters:

    • The propagation delay time (tpd) should be between 6ns and 20ns.
    • The minimum pulse width (tpw(min)) should be at least 20ns.
    • The maximum pulse width (tpw(max)) should not exceed 1000ns.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
  9. Mounting:

    • Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
    • Use appropriate heat sinks if necessary to manage thermal dissipation.
  10. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified parameters.
    • Refer to the datasheet for detailed test procedures and recommended test circuits.
(For reference only)

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