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HD75189P

Specifications

SKU: 11614688

BUY HD75189P https://www.utsource.net/itm/p/11614688.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc - 4.5 5 5.5 V
Output High Level VOH IOL = 0.4 mA 2.4 - Vcc-0.5 V
Output Low Level VOL IOH = -0.8 mA 0 - 0.5 V
Input High Level VIH - 2 - Vcc-0.5 V
Input Low Level VIL - 0 - 0.8 V
Propagation Delay Time tpd Vcc = 5V, T = 25°C - 36 - ns
Power Dissipation PD - - - 100 mW
Operating Temperature Topr - -40 - 85 °C
Storage Temperature Tstg - -55 - 150 °C

Instructions for Use

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V. The typical operating voltage is 5V.
  2. Output Levels:

    • When the output is high (VOH), it should be at least 2.4V and can go up to Vcc - 0.5V.
    • When the output is low (VOL), it should be between 0V and 0.5V.
  3. Input Levels:

    • For a valid high input (VIH), the voltage must be at least 2V and can go up to Vcc - 0.5V.
    • For a valid low input (VIL), the voltage must be between 0V and 0.8V.
  4. Propagation Delay Time (tpd):

    • The propagation delay time is typically 36 nanoseconds when Vcc is 5V and the temperature is 25°C.
  5. Power Dissipation (PD):

    • The maximum power dissipation is 100 milliwatts. Ensure the device is not subjected to excessive power to avoid damage.
  6. Operating Temperature (Topr):

    • The device can operate in temperatures ranging from -40°C to 85°C.
  7. Storage Temperature (Tstg):

    • The device can be stored in temperatures ranging from -55°C to 150°C.
  8. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Store the device in a dry, cool place to prevent moisture damage.
  9. Mounting:

    • Ensure proper soldering techniques are used to avoid thermal shock and mechanical stress.
    • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
  10. Testing:

    • Test the device under specified conditions to verify its functionality and performance.
    • Use appropriate test equipment and procedures to avoid damaging the device during testing.
(For reference only)

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