Specifications
SKU: 11617202
Parameter | Value |
---|---|
Part Number | FMH23N50E |
Type | MOSFET |
Polarity | N-Channel |
Voltage (Vds) | 50V |
Current (Id) | 23A |
Rds(on) @ 10V | 6.5 mΩ |
Power Dissipation | 110W |
Package | TO-220 |
Operating Temperature | -55°C to +150°C |
Gate Charge (Qg) | 47 nC |
Input Capacitance (Ciss) | 1680 pF at Vds = 0V, f = 1 MHz |
Output Capacitance (Coss) | 290 pF at Vds = 0V, f = 1 MHz |
Reverse Transfer Capacitance (Crss) | 120 pF at Vds = 0V, f = 1 MHz |
Thermal Resistance (Rth(j-c)) | 1.58°C/W |
Storage Temperature | -65°C to +150°C |
Instructions for Use:
Handling Precautions:
- Avoid touching the gate terminal directly to prevent electrostatic discharge (ESD).
- Use proper ESD protection equipment when handling the device.
Mounting:
- Ensure the heatsink is properly attached to the TO-220 package to dissipate heat effectively.
- Use thermal paste between the device and the heatsink to improve thermal conductivity.
Biasing:
- Apply a gate-source voltage (Vgs) within the recommended range to ensure proper operation.
- For optimal performance, use a gate resistor to limit current and reduce ringing.
Protection:
- Implement overvoltage and overcurrent protection circuits to safeguard the MOSFET.
- Use TVS diodes or Zener diodes to protect against voltage spikes.
Testing:
- Before final assembly, test the MOSFET with a multimeter to ensure it is not damaged.
- Perform functional tests under controlled conditions to verify performance.
Storage:
- Store the MOSFET in a dry, cool place away from direct sunlight.
- Keep the device in its original packaging until ready for use to prevent damage.
Soldering:
- Use a temperature-controlled soldering iron and follow the recommended soldering profile.
- Avoid overheating the device during soldering to prevent thermal damage.
Documentation:
- Refer to the datasheet for detailed electrical and mechanical specifications.
- Consult application notes for specific circuit design guidelines.
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