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FGH40N60UFD ORIGINAL GOODS IN STOCK

Specifications

SKU: 11617203

BUY FGH40N60UFD ORIGINAL GOODS IN STOCK https://www.utsource.net/itm/p/11617203.html

Parameter Description Value
Part Number FGH40N60UFD
Manufacturer Fairchild Semiconductor
Type N-Channel MOSFET
Package TO-220
VDS (Max) Drain-to-Source Voltage 600 V
VGS (Max) Gate-to-Source Voltage ±20 V
ID (Max) Continuous Drain Current 40 A
RDS(on) (Max) On-State Resistance 0.18 Ω at VGS = 10 V
Power Dissipation Maximum Power Dissipation 150 W
Operating Temperature Junction Temperature Range -55°C to +150°C
Storage Temperature Storage Temperature Range -65°C to +175°C
Total Gate Charge Total Gate Charge 120 nC
Input Capacitance Input Capacitance 1950 pF
Output Capacitance Output Capacitance 500 pF
Reverse Transfer Capacitance Reverse Transfer Capacitance 330 pF
Thermal Resistance Junction to Case 1.5°C/W
Thermal Resistance Junction to Ambient 62.5°C/W

Instructions for Use:

  1. Handling Precautions:

    • ESD Protection: The FGH40N60UFD is sensitive to electrostatic discharge (ESD). Always use proper ESD protection equipment when handling the device.
    • Polarity: Ensure correct polarity when connecting the device. Connecting the device in reverse can cause immediate damage.
  2. Mounting:

    • Heat Sinking: For high power applications, ensure adequate heat sinking to maintain the junction temperature within the specified range.
    • Torque Specifications: Follow the recommended torque specifications for screw terminals to avoid mechanical stress on the device.
  3. Operation:

    • Gate Drive: Apply a gate voltage (VGS) between 10 V and 15 V for optimal performance. Avoid exceeding the maximum VGS rating.
    • Overcurrent Protection: Implement overcurrent protection to prevent damage from excessive drain current.
    • Thermal Management: Monitor the device temperature and ensure it does not exceed the maximum operating temperature.
  4. Storage:

    • Humidity Control: Store the device in a dry environment to prevent moisture-related issues.
    • Temperature Range: Store the device within the specified storage temperature range to avoid thermal stress.
  5. Testing:

    • Initial Testing: Perform initial testing under controlled conditions to verify the device parameters.
    • Periodic Testing: Conduct periodic testing to ensure the device remains within its operational parameters.

For more detailed information, refer to the datasheet provided by Fairchild Semiconductor.

(For reference only)

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