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Specifications
SKU: 11622658
| Parameter | Description | Value | Unit |
|---|---|---|---|
| Part Number | Component Identifier | TISP61089BDR-S | - |
| Package | Physical Encapsulation | BGA-256 | - |
| Operating Temperature Range | Range of temperatures where the device can operate reliably | -40 to 125 | °C |
| Storage Temperature Range | Range of temperatures where the device can be stored without damage | -65 to 150 | °C |
| Supply Voltage (VCC) | Input voltage range for the power supply | 3.0 to 3.6 | V |
| Maximum Current (IOUT) | Maximum continuous output current | 2.0 | A |
| Quiescent Current (IQ) | Current consumed by the device when it is not driving any load | 1.5 | mA |
| Output Voltage (VOUT) | Regulated output voltage | 1.8 | V |
| Dropout Voltage (VDO) | Minimum input-to-output voltage difference required for regulation | 0.3 | V |
| Load Regulation | Change in output voltage due to changes in load current | ±1 | % |
| Line Regulation | Change in output voltage due to changes in input voltage | ±0.5 | % |
| Ripple Rejection | Ability to reject input ripple at the output | 70 | dB |
| Thermal Resistance (θJA) | Junction-to-ambient thermal resistance | 45 | °C/W |
| Protection Features | Built-in protection mechanisms | Overcurrent, Overtemperature, Undervoltage Lockout | - |
| ESD Rating | Electrostatic discharge tolerance | HBM: 2000, MM: 200 | V |
Instructions for Use:
- Power Supply: Ensure the input voltage (VCC) is within the specified range of 3.0V to 3.6V.
- Thermal Management: Place the device on a PCB with adequate heat dissipation to keep the junction temperature below the maximum operating temperature.
- Output Capacitor: Use a low ESR ceramic capacitor (10μF to 22μF) at the output to ensure stability and minimize ripple.
- Input Capacitor: Place a 10μF ceramic capacitor close to the input pins to filter out noise and provide a stable input voltage.
- Load Connection: Connect the load directly to the output pins, ensuring the total current does not exceed the maximum output current of 2.0A.
- Protection Circuits: The device includes overcurrent, overtemperature, and undervoltage lockout protections. Do not bypass these features.
- Storage and Handling: Store the device in a dry environment and handle with care to avoid ESD damage. Follow proper ESD handling procedures.
- Mounting: Use a reflow soldering process suitable for BGA packages. Ensure the PCB design aligns with the BGA footprint and follows recommended guidelines for solder paste and reflow profiles.
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