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SN74AHCT240PW

Specifications

SKU: 11641119

BUY SN74AHCT240PW https://www.utsource.net/itm/p/11641119.html

Parameter Symbol Min Typical Max Unit Notes
Supply Voltage VCC 2.0 - 5.5 V Operating range
Input Low Voltage VIL -0.5 - 0.8 V With respect to GND
Input High Voltage VIH 2.0 - VCC+0.5 V With respect to GND
Output Low Voltage VOL -0.5 - 0.4 V At IOL = 24 mA, VCC = 4.5 V
Output High Voltage VOH 2.4 - VCC+0.5 V At IOH = -24 mA, VCC = 4.5 V
Input Current IIN -1 - 1 μA At VIL = 0 V, VIH = VCC
Output Current (Sink) IOL - - -50 mA Maximum current the output can sink
Output Current (Source) IOH -50 - - mA Maximum current the output can source
Propagation Delay Time tpd - 8 20 ns For VCC = 5 V, typical value at 25°C
Power Dissipation PD - - 360 mW Per package
Operating Temperature Range TA -40 - 85 °C Commercial grade
Storage Temperature Range TSTG -65 - 150 °C Storage conditions

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 2.0 V to 5.5 V.
    • Connect the ground (GND) pin to a stable reference point.
  2. Input Signals:

    • Apply input signals that comply with the input low (VIL) and input high (VIH) voltage levels.
    • Ensure input currents do not exceed ±1 μA to avoid excessive power dissipation.
  3. Output Signals:

    • The outputs can sink up to 50 mA and source up to 50 mA.
    • Verify that the output low (VOL) and output high (VOH) voltages meet the requirements of the connected devices.
  4. Propagation Delay:

    • Account for the propagation delay time (tpd) in your timing calculations, especially in high-speed applications.
  5. Temperature Considerations:

    • Operate the device within the specified temperature range to ensure reliable performance.
    • Store the device in a controlled environment to prevent damage from extreme temperatures.
  6. Handling and ESD Protection:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Use appropriate ESD protection measures when handling or testing the device.
  7. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure proper mounting and avoid thermal stress.
    • Use a heat sink if necessary to manage power dissipation during operation.
(For reference only)

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