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HCPL-817-000

Specifications

SKU: 11646032

BUY HCPL-817-000 https://www.utsource.net/itm/p/11646032.html

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF 1.2 - 1.6 V IF = 20 mA
Reverse Voltage VR - - 5 V
Forward Current IF - - 50 mA
Peak Forward Current IF(s) - - 150 mA t = 10 ms, duty cycle ≤ 1%
Reverse Current IR - - 100 nA VR = 5 V
CTR (Current Transfer Ratio) CTR 100 300 500 % IF = 5 mA, VCE = 5 V
Collector-Emitter Voltage VCE - - 30 V
Collector Current IC - - 15 mA
Storage Temperature TSTG -40 - 105 °C
Operating Temperature TA -40 - 105 °C

Instructions for Use:

  1. Forward Voltage (VF):

    • Ensure the forward voltage does not exceed 1.6V when operating at 20mA to avoid damaging the device.
  2. Reverse Voltage (VR):

    • The device can withstand up to 5V in reverse bias without damage.
  3. Forward Current (IF):

    • Do not exceed 50mA of continuous forward current to prevent overheating and potential failure.
  4. Peak Forward Current (IF(s)):

    • For short pulses, the peak forward current can be as high as 150mA, but ensure the pulse duration is limited to 10ms with a duty cycle of 1% or less.
  5. Reverse Current (IR):

    • The reverse leakage current should not exceed 100nA at 5V reverse voltage.
  6. CTR (Current Transfer Ratio):

    • The CTR ranges from 100% to 500% at a forward current of 5mA and a collector-emitter voltage of 5V. This indicates the efficiency of current transfer from the input to the output.
  7. Collector-Emitter Voltage (VCE):

    • The maximum collector-emitter voltage is 30V. Exceeding this can cause breakdown and damage to the device.
  8. Collector Current (IC):

    • The maximum collector current is 15mA. Higher currents can lead to overheating and failure.
  9. Storage Temperature (TSTG):

    • Store the device between -40°C and 105°C to ensure reliability and performance.
  10. Operating Temperature (TA):

    • The device can operate within the temperature range of -40°C to 105°C. Ensure adequate cooling if operating near the upper limit to prevent thermal runaway.

Additional Notes:

  • Always use appropriate heat sinks or cooling mechanisms if the device is expected to operate at high currents or temperatures.
  • Ensure proper PCB layout to minimize noise and interference.
  • Follow ESD (Electrostatic Discharge) precautions during handling and installation to avoid damage to the device.
(For reference only)

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