Specifications
SKU: 11646373
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (VCC) | Operating supply voltage range | 2.7 | - | 5.5 | V |
Output Current (IO) | Maximum output current per channel | - | 50 | - | mA |
Channel-to-Channel Isolation | Isolation between channels | - | 2.5 | - | kV |
Operating Temperature (TA) | Ambient operating temperature range | -40 | - | 85 | °C |
Storage Temperature (TSTG) | Storage temperature range | -65 | - | 150 | °C |
Input Capacitance (CIN) | Input capacitance per channel | - | 10 | - | pF |
Output Capacitance (COUT) | Output capacitance per channel | - | 10 | - | pF |
Propagation Delay (tPD) | Propagation delay time | - | 100 | - | ns |
Power Dissipation (PDISS) | Maximum power dissipation | - | 700 | - | mW |
Instructions for Using MAX319ESA+
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.7V to 5.5V.
- Connect the VCC pin to the positive supply and GND to the ground.
Channel Configuration:
- The MAX319ESA+ supports multiple channels. Configure each channel according to your application requirements.
- Use the control inputs to enable or disable specific channels.
Output Current:
- Each channel can source or sink up to 50mA. Ensure the load connected to each channel does not exceed this limit to avoid damage.
Isolation:
- The device provides 2.5kV isolation between channels. This ensures that high-voltage signals do not interfere with low-voltage circuits.
Temperature Considerations:
- The ambient operating temperature should be between -40°C and 85°C.
- Store the device in an environment where the temperature ranges from -65°C to 150°C.
Capacitance:
- The input and output capacitance for each channel is 10pF. Consider this when designing your circuit to avoid signal degradation.
Propagation Delay:
- The typical propagation delay is 100ns. Account for this delay in your timing calculations.
Power Dissipation:
- The maximum power dissipation is 700mW. Ensure proper heat dissipation if the device is operating near its maximum power rating.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Mount the device on a PCB using standard surface mount technology (SMT) techniques.
- Ensure good thermal management by providing adequate copper area for heat dissipation.
Testing:
- After installation, test the device under various conditions to ensure it meets the specified performance parameters.
- Verify the functionality of each channel and the overall system integration.
Inquiry - MAX319ESA+