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MAX319ESA+

Specifications

SKU: 11646373

BUY MAX319ESA+ https://www.utsource.net/itm/p/11646373.html

Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage range 2.7 - 5.5 V
Output Current (IO) Maximum output current per channel - 50 - mA
Channel-to-Channel Isolation Isolation between channels - 2.5 - kV
Operating Temperature (TA) Ambient operating temperature range -40 - 85 °C
Storage Temperature (TSTG) Storage temperature range -65 - 150 °C
Input Capacitance (CIN) Input capacitance per channel - 10 - pF
Output Capacitance (COUT) Output capacitance per channel - 10 - pF
Propagation Delay (tPD) Propagation delay time - 100 - ns
Power Dissipation (PDISS) Maximum power dissipation - 700 - mW

Instructions for Using MAX319ESA+

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.7V to 5.5V.
    • Connect the VCC pin to the positive supply and GND to the ground.
  2. Channel Configuration:

    • The MAX319ESA+ supports multiple channels. Configure each channel according to your application requirements.
    • Use the control inputs to enable or disable specific channels.
  3. Output Current:

    • Each channel can source or sink up to 50mA. Ensure the load connected to each channel does not exceed this limit to avoid damage.
  4. Isolation:

    • The device provides 2.5kV isolation between channels. This ensures that high-voltage signals do not interfere with low-voltage circuits.
  5. Temperature Considerations:

    • The ambient operating temperature should be between -40°C and 85°C.
    • Store the device in an environment where the temperature ranges from -65°C to 150°C.
  6. Capacitance:

    • The input and output capacitance for each channel is 10pF. Consider this when designing your circuit to avoid signal degradation.
  7. Propagation Delay:

    • The typical propagation delay is 100ns. Account for this delay in your timing calculations.
  8. Power Dissipation:

    • The maximum power dissipation is 700mW. Ensure proper heat dissipation if the device is operating near its maximum power rating.
  9. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  10. Mounting:

    • Mount the device on a PCB using standard surface mount technology (SMT) techniques.
    • Ensure good thermal management by providing adequate copper area for heat dissipation.
  11. Testing:

    • After installation, test the device under various conditions to ensure it meets the specified performance parameters.
    • Verify the functionality of each channel and the overall system integration.
(For reference only)

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